EPF10K200SRC240-2X

The EPF10K200SRC240-2X is a FLEX-10KS® field programmable gate array from Altera, delivered in a 240-BFQFP exposed pad package. It provides reconfigurable digital logic with 9,984 logic elements and 182 general-purpose I/O pins for flexible system integration.

This commercial-grade, surface-mount FPGA supports a 2.375 V to 2.625 V core supply and operates across a 0 °C to 70 °C temperature range, making it suitable for a wide range of standard commercial electronic designs where on-chip logic density and I/O count are primary requirements.

Key Features

• Logic Capacity  Offers 9,984 logic elements to implement custom digital functions, state machines, and glue logic within a single device.
• Embedded Memory  Includes approximately 0.098 Mbits of on-chip RAM (98,304 total RAM bits) to support small FIFOs, registers, and buffer storage for logic designs.
• I/O Count  Provides 182 I/O pins, enabling multiple interface connections and signal routing for complex boards.
• Package and Mounting  Supplied in a 240-BFQFP exposed pad package (supplier package: 240-RQFP, 32×32) for surface-mount assembly and improved thermal contact through the exposed pad.
• Power  Requires a core voltage supply in the range of 2.375 V to 2.625 V to meet device operating conditions.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 70 °C for standard environmental conditions.
• Compliance  RoHS compliant for regulatory and environmental alignment in manufacturing.

Typical Applications

• Prototyping and Development  Reconfigurable logic density and a high I/O count make the device suitable for digital design validation and iterative development.
• Interface Bridging  Use the 182 I/O pins to implement protocol converters, bus glue, and custom interface logic between system components.
• Custom Control Logic  Deploy the device for application-specific finite-state machines, timing control, and control-path logic within commercial electronic products.

Unique Advantages

• Substantial Logic Resources:  9,984 logic elements provide the capacity to consolidate multiple discrete functions into a single FPGA, reducing board complexity.
• On-Chip Memory:  Approximately 0.098 Mbits of embedded RAM supports local buffering and state storage without external memory.
• High I/O Count:  182 I/Os enable direct interfacing to a variety of peripherals and signals, minimizing the need for additional I/O expanders.
• Exposed-Pad Package:  The 240-BFQFP exposed pad package supports surface-mount assembly and provides a thermal contact point for improved heat dissipation.
• Controlled Power Envelope:  A defined core voltage window (2.375 V to 2.625 V) simplifies power-supply design and voltage sequencing for reliable operation.
• RoHS Compliance:  Meets RoHS requirements to help align with environmental manufacturing standards.

Why Choose EPF10K200SRC240-2X?

The EPF10K200SRC240-2X delivers a balanced combination of logic capacity, on-chip memory, and a high number of I/Os in a commercial-grade FPGA package. Its specifications suit engineers and designers who need reconfigurable logic and interface flexibility while maintaining a defined thermal and power profile.

This device is well suited for designs that require consolidating digital functions, implementing custom control logic, or bridging multiple interfaces on a single board. Its exposed-pad BFQFP package and RoHS compliance contribute to practical manufacturability and standard commercial deployment.

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