EPF10K200SFC672-3

The EPF10K200SFC672-3 is a FLEX-10KS® family field programmable gate array from Intel, delivered in a 672-ball BGA surface-mount package. This mid-to-high density FPGA provides 9,984 logic elements, 98,304 bits of embedded RAM, and up to 470 user I/O pins, making it suitable for complex logic integration and I/O-intensive designs within commercial temperature ranges.

Built on the FLEX 10K family architecture, the device supports embedded programmable logic and memory resources that enable system-level integration and flexible logic implementation for a range of embedded applications.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) and 513,000 equivalent gates provide substantial combinational and sequential logic resources for mid-range FPGA designs.
• Embedded Memory — 98,304 total RAM bits (approximately 0.098 Mbits) to implement on-chip buffers, FIFOs, and small data stores without external memory.
• High I/O Count — Up to 470 user I/O pins to support dense peripheral interfacing and complex board-level connectivity.
• Package and Mounting — 672-ball BGA (supplier device package: 672-FBGA, 27×27) in a surface-mount form factor for compact PCB layouts.
• Power Supply — Core voltage range of 2.375 V to 2.625 V, enabling integration with platform power rails that meet this supply window.
• Operating Range — Commercial-grade operating temperature from 0 °C to 70 °C, suitable for standard commercial applications.
• RoHS Compliant — Conforms to RoHS environmental requirements for lead-free assembly processes.

Typical Applications

• System Integration and Prototyping — Implement SOPC-style integration and complex glue logic where 9,984 logic elements and embedded memory help consolidate functions onto a single FPGA.
• Communications and Networking — Use the high I/O count and on-chip RAM for protocol bridging, packet buffering, and interface aggregation.
• High-Channel I/O Control — Support multi-channel sensor or peripheral interfaces that require large numbers of configurable I/O pins and on-chip routing.
• Embedded Logic Acceleration — Offload compute-intensive and custom logic functions into the FPGA fabric to reduce external component count and simplify board-level design.

Unique Advantages

• Balanced Logic and Memory Mix — 9,984 logic elements paired with 98,304 bits of embedded RAM enable compact implementations of logic-plus-buffering functions without immediate need for external memory.
• Large I/O Resource — 470 I/O pins provide flexible connectivity for multi-interface systems, reducing the need for external I/O expanders.
• Space-Efficient Package — 672-ball BGA in a 27×27 supplier package footprint helps maximize board space efficiency for dense designs.
• Commercial Temperature Suitability — Rated for 0 °C to 70 °C operation to match typical commercial product environments.
• RoHS Compliance — Aligns with lead-free assembly and environmental compliance requirements for commercial electronics.

Why Choose EPF10K200SFC672-3?

The EPF10K200SFC672-3 positions itself as a flexible mid-to-high density FPGA option within the FLEX 10K family, combining nearly 10,000 logic elements, substantial on-chip RAM, and a high I/O count in a compact 672-BBGA package. It is well suited to commercial designs that require significant programmable logic, on-chip buffering, and dense board-level interconnect in a surface-mount form factor.

Engineers designing communication bridges, I/O-heavy controllers, or system-level programmable logic modules will find this device provides a balanced mix of resources and a clear specification set for integration into commercial temperature-range products.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for the EPF10K200SFC672-3.