EPF10K200SFC672-1

IC FPGA 470 I/O 672FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 672-BBGA

Quantity 1,020 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case672-BBGANumber of I/O470Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SFC672-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 672-BBGA

The EPF10K200SFC672-1 is a commercial-grade FLEX‑10KS family FPGA delivered in a 672-BBGA package. It combines a high-density logic array with substantial on-chip memory and broad I/O, designed for system-level programmable logic and embedded integration.

Typical uses include SOPC-style integration, high-pin-count I/O interfacing and custom logic functions where reprogrammability, on-chip RAM and a compact BGA footprint are required. The device is RoHS compliant and optimized for surface-mount board assembly.

Key Features

  • Logic Capacity  9,984 logic elements and 1,248 logic array blocks (LABs) provide substantial programmable logic resources for complex designs.
  • On-chip Memory  98,304 total RAM bits (approximately 0.098 Mbits) of embedded memory for FIFOs, buffers and state storage.
  • High I/O Count  Up to 470 user I/O pins to support dense external interfacing and multi-channel connectivity.
  • Gate Equivalent  Device data lists approximately 513,000 gates, enabling large-scale logic integration within a single FPGA package.
  • Power and Voltage  Specified supply voltage range of 2.375 V to 2.625 V to match system power rails and integration requirements.
  • Package and Mounting  672‑BBGA package (supplier package 672‑FBGA, 27×27) optimized for surface-mount PCB assembly where board space and pin density matter.
  • Operating Range  Commercial operating temperature range from 0 °C to 70 °C for standard embedded applications.
  • In-circuit Reconfigurability & Test  Family datasheet documents support for in-circuit reconfigurability and built-in JTAG boundary-scan test (IEEE Std. 1149.1), enabling field updates and board-level testability.
  • RoHS Compliant  Conforms to RoHS requirements for lead-free electronics manufacturing.

Typical Applications

  • System Integration & SOPC  Implement embedded megafunctions and custom system logic for compact System-on-a-Programmable-Chip designs.
  • High‑I/O Data Interfaces  Use the 470 I/O pins for multi-channel communications, parallel interfaces and dense sensor or peripheral connectivity.
  • Memory‑Intensive Functions  Leverage on-chip RAM for buffering, packet queues and small data-store functions in networking or data-acquisition modules.
  • Prototyping and Custom Logic  Ideal for development platforms and custom control logic where reprogrammability and significant gate count are required.

Unique Advantages

  • Substantial Logic and Memory in One Device: Combines nearly 10k logic elements with 98,304 bits of embedded RAM to consolidate functions that otherwise require multiple components.
  • High Pin Density Packaging: 672-ball BGA/FBGA options provide high I/O density in a compact 27×27 footprint, helping reduce PCB area and simplify routing.
  • Field Reconfiguration and Testability: Support for in-circuit reconfigurability and JTAG boundary-scan enables firmware updates and board-level testing without consuming user logic.
  • Commercial‑Grade Availability: Designed for commercial applications with a standard 0 °C to 70 °C operating range and RoHS compliance for modern manufacturing.
  • Integration‑Friendly Power Range: Narrow supply voltage specification (2.375–2.625 V) simplifies power sequencing and integration with regulated system rails.

Why Choose EPF10K200SFC672-1?

The EPF10K200SFC672-1 positions itself as a high-density, reprogrammable logic resource for commercial embedded designs that need substantial logic elements, on-chip RAM and a large number of I/O signals in a space-efficient BGA package. Its combination of logic capacity, embedded memory and JTAG-enabled testability makes it suitable for customers building compact, reconfigurable systems or consolidating multiple discrete functions into a single programmable device.

Engineers and procurement teams will find long-term value in the FLEX‑10KS family ecosystem as reflected in the device datasheet capabilities for system integration, in-circuit reconfiguration and board-level test support. The device is RoHS compliant and provided in surface-mount BGA packaging for modern assembly workflows.

Request a quote or submit a pricing and availability inquiry to evaluate the EPF10K200SFC672-1 for your next design project.

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