EPF10K200SFC672-1
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 672-BBGA |
|---|---|
| Quantity | 1,020 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 470 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SFC672-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 672-BBGA
The EPF10K200SFC672-1 is a commercial-grade FLEX‑10KS family FPGA delivered in a 672-BBGA package. It combines a high-density logic array with substantial on-chip memory and broad I/O, designed for system-level programmable logic and embedded integration.
Typical uses include SOPC-style integration, high-pin-count I/O interfacing and custom logic functions where reprogrammability, on-chip RAM and a compact BGA footprint are required. The device is RoHS compliant and optimized for surface-mount board assembly.
Key Features
- Logic Capacity 9,984 logic elements and 1,248 logic array blocks (LABs) provide substantial programmable logic resources for complex designs.
- On-chip Memory 98,304 total RAM bits (approximately 0.098 Mbits) of embedded memory for FIFOs, buffers and state storage.
- High I/O Count Up to 470 user I/O pins to support dense external interfacing and multi-channel connectivity.
- Gate Equivalent Device data lists approximately 513,000 gates, enabling large-scale logic integration within a single FPGA package.
- Power and Voltage Specified supply voltage range of 2.375 V to 2.625 V to match system power rails and integration requirements.
- Package and Mounting 672‑BBGA package (supplier package 672‑FBGA, 27×27) optimized for surface-mount PCB assembly where board space and pin density matter.
- Operating Range Commercial operating temperature range from 0 °C to 70 °C for standard embedded applications.
- In-circuit Reconfigurability & Test Family datasheet documents support for in-circuit reconfigurability and built-in JTAG boundary-scan test (IEEE Std. 1149.1), enabling field updates and board-level testability.
- RoHS Compliant Conforms to RoHS requirements for lead-free electronics manufacturing.
Typical Applications
- System Integration & SOPC Implement embedded megafunctions and custom system logic for compact System-on-a-Programmable-Chip designs.
- High‑I/O Data Interfaces Use the 470 I/O pins for multi-channel communications, parallel interfaces and dense sensor or peripheral connectivity.
- Memory‑Intensive Functions Leverage on-chip RAM for buffering, packet queues and small data-store functions in networking or data-acquisition modules.
- Prototyping and Custom Logic Ideal for development platforms and custom control logic where reprogrammability and significant gate count are required.
Unique Advantages
- Substantial Logic and Memory in One Device: Combines nearly 10k logic elements with 98,304 bits of embedded RAM to consolidate functions that otherwise require multiple components.
- High Pin Density Packaging: 672-ball BGA/FBGA options provide high I/O density in a compact 27×27 footprint, helping reduce PCB area and simplify routing.
- Field Reconfiguration and Testability: Support for in-circuit reconfigurability and JTAG boundary-scan enables firmware updates and board-level testing without consuming user logic.
- Commercial‑Grade Availability: Designed for commercial applications with a standard 0 °C to 70 °C operating range and RoHS compliance for modern manufacturing.
- Integration‑Friendly Power Range: Narrow supply voltage specification (2.375–2.625 V) simplifies power sequencing and integration with regulated system rails.
Why Choose EPF10K200SFC672-1?
The EPF10K200SFC672-1 positions itself as a high-density, reprogrammable logic resource for commercial embedded designs that need substantial logic elements, on-chip RAM and a large number of I/O signals in a space-efficient BGA package. Its combination of logic capacity, embedded memory and JTAG-enabled testability makes it suitable for customers building compact, reconfigurable systems or consolidating multiple discrete functions into a single programmable device.
Engineers and procurement teams will find long-term value in the FLEX‑10KS family ecosystem as reflected in the device datasheet capabilities for system integration, in-circuit reconfiguration and board-level test support. The device is RoHS compliant and provided in surface-mount BGA packaging for modern assembly workflows.
Request a quote or submit a pricing and availability inquiry to evaluate the EPF10K200SFC672-1 for your next design project.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018