EPF10K200SFC672-1X

The EPF10K200SFC672-1X is a FLEX-10KS series Field Programmable Gate Array (FPGA) in a 672-ball BGA package designed for commercial embedded and system integration applications. Based on the FLEX 10K family architecture, it provides a balance of configurable logic, embedded memory, and high I/O density for mid-range programmable logic implementations.

This device targets applications requiring extensive I/O connectivity and on-chip RAM for buffering or megafunctions, offering flexible I/O options and series-level features such as embedded arrays, JTAG configuration, and dedicated arithmetic/cascade chains for efficient logic implementation.

Key Features

• Core Logic   Approximately 9,984 logic elements to implement mid-range digital logic and control functions.
• Gate Capacity   513,000 gates, enabling substantial system logic integration on a single device.
• Embedded Memory   98,304 total RAM bits of on-chip RAM for data buffering, state storage, and megafunction support.
• I/O Density & Package   470 user I/O pins in a 672-BBGA (672-FBGA, 27×27) surface-mount package for dense board-level interfacing and signal routing.
• Power Supply   Core voltage supply range 2.375 V to 2.625 V as specified for this device.
• Operating Range & Grade   Commercial grade operation with an operating temperature range of 0 °C to 70 °C.
• Configuration & Test   Series-level support for in-circuit reconfigurability and built-in JTAG boundary-scan (IEEE 1149.1) for device programming and board-level test.
• Architecture-Level Features   FLEX 10K family features such as an embedded array for megafunctions, dedicated carry and cascade chains for arithmetic and high-fan-in logic, and low-skew clock distribution (series-level capabilities documented in the FLEX 10K datasheet).
• I/O Flexibility   Series-level programmable output slew-rate control, per-pin tri-state and open-drain options, and support for multi-voltage I/O interfaces as described for the FLEX 10K family.
• Compliance   RoHS compliant.

Typical Applications

• Embedded Systems   Implement SOPC-style integration and on-chip megafunctions where configurable logic and embedded memory consolidate system functions.
• High-Density I/O Interfaces   Use the device to consolidate multiple parallel or serial interfaces, leveraging 470 user I/Os in the 672-BBGA package for board-level connectivity.
• Data Buffering & Processing   Applications needing on-chip RAM for buffering, packet handling, or temporary data storage can benefit from the device’s 98,304 RAM bits.
• Prototyping & Control Logic   Rapidly implement and iterate control, glue-logic, and custom state machines using the programmable logic resources.

Unique Advantages

• High I/O Count for Interface Consolidation: 470 user I/Os enable integration of multiple external peripherals and buses without adding external logic.
• Significant On-Chip Memory: 98,304 bits of embedded RAM reduce reliance on external memory for many buffering and state applications.
• Mid-Range Logic Capacity: Nearly 10k logic elements and 513,000 gates provide capacity for complex control, glue-logic, and medium-scale datapaths.
• Compact BGA Packaging: 672-BBGA (27×27) surface-mount package delivers high pin count in a footprint-optimized form factor for dense board layouts.
• Series-Level Integration Features: FLEX 10K family features such as dedicated carry/cascade chains, low-skew clock trees, and JTAG support simplify implementation of arithmetic, high-fan-in logic, and debug/test workflows.
• RoHS Compliant: Contributes to regulatory and manufacturing process compliance requirements.

Why Choose EPF10K200SFC672-1X?

The EPF10K200SFC672-1X offers a balanced combination of logic capacity, substantial on-chip RAM, and a very high I/O count in a compact 672-BBGA package, making it well suited for designers building embedded systems, interface-rich modules, and mid-range programmable logic solutions. Its FLEX 10K family features—embedded arrays for megafunctions, dedicated arithmetic chains, and JTAG-based configuration—provide a practical platform for consolidating system functions and accelerating development.

This device is positioned for commercial applications where board-level I/O density, integrated memory, and configurable logic are priorities. Its architecture and series-level capabilities support scalable designs and reuse across similar FLEX 10K devices from the same family.

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