EPF10K200SFC672-2

The EPF10K200SFC672-2 is an Intel FLEX-10KS family field programmable gate array (FPGA) provided in a 672‑ball BGA package for surface-mount assembly. It delivers mid-range programmable logic density with dedicated on-chip RAM and a large I/O count for system integration tasks in commercial applications.

This device is targeted at designs that require flexible logic capacity, embedded memory, and high I/O density within a commercial temperature range, enabling board-level integration and configurable system functions.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) and a reported 513,000 gates, providing mid-range programmable logic resources for complex combinational and sequential functions.
• Embedded Memory — Total on-chip RAM of 98,304 bits (approximately 98 kbits) to support storage, buffering, and embedded-data functions without external memory.
• I/O Density — 470 user I/O pins, enabling extensive peripheral interfacing and board-level connectivity.
• Package & Mounting — 672‑BBGA (supplier package: 672‑FBGA, 27 × 27 mm) in a surface-mount form factor for compact PCB layouts.
• Power Supply — Core/required supply range specified as 2.375 V to 2.625 V to match system power domains.
• Operating Grade — Commercial grade operation with an ambient temperature range of 0 °C to 70 °C.
• Standards & Testability — Family-level features include JTAG boundary-scan test (IEEE Std. 1149.1) circuitry (as documented for the FLEX 10K family) to support board-level test and in-circuit configuration workflows.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• System Integration / SOPC — Implement system-on-a-programmable-chip functions and integrate specialized logic and memory megafunctions directly on-board.
• High-Density I/O Interfaces — Drive multi-channel interfaces, bus bridging, or front-end I/O aggregation where a large number of user I/O pins is required.
• Embedded Memory and Buffering — Use the device’s on-chip RAM for data buffering, small FIFOs, or local lookup tables to reduce external memory requirements.
• Prototyping and Board-Level Glue Logic — Provide reconfigurable logic for prototyping, glue logic, or control functions in commercial electronic products.

Unique Advantages

• Balanced logic and memory resources: Nearly 10k logic elements combined with ~98 kbits of embedded RAM enables mixed compute and data-storage tasks on a single device.
• High I/O capacity: 470 I/O pins support complex peripheral and bus connectivity without extensive external multiplexing.
• Compact BGA footprint: 672‑ball BGA (27 × 27 mm) provides a high-pin-count package while conserving board area.
• Commercial-grade specification: Rated for 0 °C to 70 °C operation to match mainstream commercial product environments.
• Design and test support (family-level): FLEX 10K family features such as IEEE‑1149.1 JTAG boundary-scan facilitate board test and in-circuit configuration approaches.
• RoHS compliant: Supports environmentally regulated assembly processes.

Why Choose EPF10K200SFC672-2?

The EPF10K200SFC672-2 positions itself as a mid-density, commercially rated FPGA option for designs that need a combination of substantial logic resources, embedded RAM, and extensive I/O in a compact BGA package. Its specification set makes it suitable for system integration tasks, on-board memory buffering, and configurable interface logic where commercial temperature operation and RoHS compliance are required.

Engineers and procurement teams choosing this device benefit from a clear specification of logic, memory, I/O, package, and supply requirements—enabling predictable board integration, BOM planning, and scalability within the FLEX‑10K family roadmap documented at the series level.

Request a quote or submit a procurement inquiry to get pricing, availability, and lead-time information for EPF10K200SFC672-2.