EPF10K200SFC484-3

IC FPGA 369 I/O 484FBGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA

Quantity 647 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O369Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SFC484-3 – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA

The EPF10K200SFC484-3 is a FLEX 10K family field programmable logic device from Intel (Altera), designed for commercial embedded logic applications. It combines a logic array and embedded memory resources to support system-level integration and megafunction implementation on a single programmable device.

With approximately 9,984 logic elements, about 98,304 bits of on-chip RAM, and 369 user I/O, this surface-mount 484-BBGA device targets commercial designs that require medium-density programmable logic, flexible I/O and embedded memory for glue logic, protocol handling and custom peripheral functions.

Key Features

  • FLEX 10K architecture Embedded programmable logic device family features including an embedded array for megafunctions and a logic array for general logic functions.
  • Logic capacity Approximately 9,984 logic elements and 513,000 gates to implement medium-density digital designs.
  • Embedded memory Total RAM bits: 98,304 (approximately 0.098 Mbits) for on-chip storage and megafunctions.
  • High I/O count 369 user I/O pins to support broad interfacing requirements in board-level systems.
  • Power supply Device supply range specified at 2.375 V to 2.625 V for core operation.
  • Packaging and mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23), surface-mount for compact board integration.
  • Commercial operating range Rated for 0 °C to 70 °C operation and designated commercial grade.
  • Series-level system features FLEX 10K series capabilities include MultiVolt I/O support, built-in JTAG boundary-scan (IEEE 1149.1), FastTrack interconnect, dedicated carry and cascade chains, and ClockLock/ClockBoost options as defined by the FLEX 10K family datasheet.
  • Environmental compliance RoHS compliant for lead-free assembly processes.

Typical Applications

  • Embedded control and glue logic Implements custom control, decoding and interface glue between processors, peripherals and discrete logic.
  • Communications and protocol bridging Handles protocol translation, parallel/serial interfacing and custom peripheral logic using the device's high I/O count and embedded memory.
  • Consumer and commercial electronics Integrates application-specific logic and on-chip memory for feature-rich commercial products.
  • Prototyping and development platforms Medium-density logic and abundant I/O make the part suitable for proof-of-concept and system validation on commercial designs.

Unique Advantages

  • System integration in a single device: Embedded array and logic array enable megafunctions and general logic to coexist, reducing external component count.
  • Generous I/O for board-level interfacing: 369 user I/O pins support multiple peripherals and bus connections without external expanders.
  • On-chip RAM for function-local data: Approximately 98,304 bits of embedded memory provide local storage for buffers, tables and state machines.
  • Commercial-focused thermal and electrical spec: Surface-mount 484-BBGA packaging and 0 °C to 70 °C rating align with commercial product development and assembly processes.
  • Series-proven features: FLEX 10K family capabilities such as JTAG boundary-scan, FastTrack interconnect and dedicated carry/cascade chains support robust design practices.
  • RoHS compliant: Supports lead-free manufacturing flows.

Why Choose EPF10K200SFC484-3?

The EPF10K200SFC484-3 offers a balanced combination of logic density, embedded memory and high I/O count in a compact 484-BBGA package for commercial embedded designs. As part of the FLEX 10K family from Intel (Altera), it brings series-level capabilities—such as JTAG boundary-scan, dedicated arithmetic and cascade resources, and flexible interconnect—that simplify implementation of common system functions and megafunctions.

This device is well suited for design teams developing commercial electronics that require medium-density programmable logic, extensive board-level interfacing and integrated on-chip memory. Its package and RoHS compliance support modern surface-mount assembly and manufacturing processes.

Request a quote or submit an inquiry to evaluate EPF10K200SFC484-3 for your next commercial embedded design.

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