EPF10K200SFC484-2

The EPF10K200SFC484-2 is a FLEX 10K family field programmable gate array (FPGA) manufactured by Intel. It provides a high-density, embedded programmable logic option with 9,984 logic elements and 98,304 bits of on-chip RAM for implementing custom logic, glue logic, and embedded functions.

Designed for surface-mount board-level integration, this commercially graded device combines substantial I/O capacity with a compact 484‑BBGA package, making it suitable for mid- to high-density system designs that require reconfigurable logic and memory resources.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) to implement complex combinational and sequential logic.
• Embedded Memory — 98,304 total RAM bits of on-chip memory for buffering, FIFOs, and small embedded data storage.
• I/O Density — 369 user I/O pins to support wide peripheral connectivity and parallel interfaces.
• Gate Equivalent — Specified with 513,000 gates for system-level resource planning.
• Package & Mounting — 484‑BBGA package (supplier package: 484‑FBGA, 23 × 23 mm); surface-mount device for compact PCB layouts.
• Power Supply — Operates from a 2.375 V to 2.625 V supply range, enabling integration with appropriate system power rails.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Compliance — RoHS compliant.
• FLEX 10K Family Capabilities — As part of the FLEX 10K family, the device benefits from series-level features such as embedded programmable logic architecture, in-circuit reconfigurability, and built-in boundary-scan (JTAG) test support described in the FLEX 10K family documentation.

Typical Applications

• Custom Logic & Glue — Implement bus bridging, protocol adaptation, and bespoke glue logic using the device’s 9,984 logic elements and high I/O count.
• Embedded Control — Use on-chip RAM and logic to implement control engines, state machines, and peripheral supervision in commercial electronics.
• Communication Interfaces — Support parallel and multi-signal interface implementations where large numbers of I/O and moderate logic density are required.
• Prototyping & Proof-of-Concept — Rapidly iterate hardware designs that require reconfigurable logic with substantial embedded memory and I/O resources.

Unique Advantages

• Substantial Logic Resource: 9,984 logic elements provide ample capacity for mid-range implementation of custom functions without relying on external glue ICs.
• High I/O Count: 369 user I/Os enable direct interfacing to multiple peripherals and parallel buses, reducing the need for external I/O expanders.
• On‑Chip Memory: 98,304 bits of embedded RAM facilitate local buffering and small data structures, minimizing external memory dependence for many designs.
• Compact, Board‑Level Package: 484‑BBGA (484‑FBGA, 23 × 23 mm) supports high-density PCB layouts while remaining surface-mount compatible.
• Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 70 °C) and RoHS compliance meet typical requirements for consumer and commercial electronics projects.

Why Choose EPF10K200SFC484-2?

The EPF10K200SFC484-2 positions itself as a versatile, mid-density FPGA option within the FLEX 10K family, balancing logic capacity, embedded memory, and a large I/O complement in a space-efficient BGA package. It is well-suited for engineers developing commercial electronic products that require reconfigurable logic, on-chip buffering, and extensive peripheral interfacing.

Choose this device when your design calls for a commercially graded, RoHS-compliant FPGA that supports significant custom logic and I/O integration while maintaining compact board footprint and surface-mount assembly.

Request a quote or contact sales to discuss pricing, availability, and how the EPF10K200SFC484-2 can fit into your next design.