EPF10K200SFC484-2N
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA |
|---|---|
| Quantity | 575 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 369 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SFC484-2N – FLEX-10KS® Field Programmable Gate Array (FPGA) IC 369 98304 9984 484-BBGA
The EPF10K200SFC484-2N is a commercial-grade FLEX-10KS series field programmable gate array (FPGA) in a 484-ball BGA package. It provides a balanced combination of logic capacity, embedded memory, and high I/O count for system-level integration in a surface-mount form factor.
Designed for system architects and embedded digital designers, this device targets applications that require programmable logic, substantial I/O connectivity, and on-chip RAM while operating within a 0 °C to 70 °C commercial temperature range and a 2.375 V to 2.625 V supply window.
Key Features
- Logic Capacity — Provides 9,984 logic elements, enabling implementation of mid-density logic designs and custom digital functions.
- Embedded Memory — Includes 98,304 bits of on-chip RAM (approximately 0.098 Mbits) to support data buffering, FIFOs, and embedded storage without external memory.
- High I/O Count — 369 user I/O pins for wide peripheral and system interfacing options in complex designs.
- Gate Equivalence — Specified at 513,000 gates for design planning and comparison against system requirements.
- Package & Mounting — Supplied in a 484-ball BGA (supplier package: 484-FBGA, 23 × 23) optimized for surface-mount PCB assembly to maximize board density.
- Power Supply — Operates from 2.375 V to 2.625 V supply, enabling designs that require this specific core voltage range.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Environmental Compliance — RoHS compliant for regulatory and manufacturing compliance.
- Series-Level Capabilities — As part of the FLEX 10K family, the series includes architecture-level features such as embedded arrays for megafunctions, JTAG boundary-scan support, low-skew clock distribution, and software tool support for place-and-route and design entry (family features documented in the FLEX 10K data sheet).
Typical Applications
- System Integration and SOPC — Use as a reprogrammable logic hub for system-on-a-programmable-chip designs that require integration of custom logic and on-chip memory.
- Interface Aggregation — Ideal for consolidating multiple peripheral interfaces and glue logic where large numbers of I/O pins are needed.
- Embedded Memory Tasks — On-chip RAM supports buffering and temporary data storage for packet handling, frame buffering, or intermediate compute stages.
- Mid-Density FPGA Designs — Suited to designs that require roughly 10k logic elements and substantial gate-equivalence capacity in a compact BGA package.
Unique Advantages
- Substantial Logic Resource: 9,984 logic elements provide a practical balance of density for mid-range programmable designs without necessitating higher-tier devices.
- Embedded Memory On-Board: 98,304 bits of on-chip RAM reduce dependence on external memory for many buffering and temporary storage tasks, simplifying BOM and layout.
- High Connectivity: 369 I/O pins give designers flexibility to connect multiple peripherals, buses, and off-chip devices directly to the FPGA.
- Compact BGA Footprint: 484-ball BGA (23 × 23) enables high routing density and a compact board layout for space-constrained systems.
- Commercial Operating Range: Specified 0 °C to 70 °C operation for mainstream electronic products and commercial applications.
- RoHS Compliant: Conforms to lead-free manufacturing requirements to support regulatory and environmental objectives.
Why Choose EPF10K200SFC484-2N?
The EPF10K200SFC484-2N positions itself as a practical, mid-density FLEX-10KS FPGA choice for teams needing near 10k logic elements, substantial on-chip RAM, and a high I/O count in a 484-ball BGA package. Its commercial-grade specification and RoHS compliance make it suitable for production consumer and industrial-adjacent applications that fit the specified temperature and voltage ranges.
Being part of the FLEX 10K family, designers benefit from documented series-level capabilities such as embedded arrays and JTAG support along with available software tool support for synthesis and place-and-route workflows, helping accelerate development and deployment.
Request a quote or submit your procurement inquiry now to evaluate EPF10K200SFC484-2N for your next programmable-logic design project. Include your quantity and delivery requirements for a tailored response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018