EPF10K200SBC600-1

IC FPGA 470 I/O 600BGA
Part Description

FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 600-BGA

Quantity 636 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package600-BGA (45x45)GradeCommercialOperating Temperature0°C – 70°C
Package / Case600-BGANumber of I/O470Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1248Number of Logic Elements/Cells9984
Number of Gates513000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits98304

Overview of EPF10K200SBC600-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) 600-BGA

The EPF10K200SBC600-1 is a FLEX 10K series embedded programmable logic device (FPGA) in a 600-ball BGA package. It combines nearly 10,000 logic elements with a substantial on-chip memory footprint and a high IO count to address complex digital integration tasks.

Designed for commercial applications, this surface-mount FPGA offers a compact 45×45 600-BGA package, a supply range of 2.375 V to 2.625 V, and an operating temperature range of 0 °C to 70 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity  9,984 logic elements suitable for implementing medium-density logic and control functions.
  • On-chip Memory  Approximately 0.098 Mbits (98,304 bits) of embedded RAM for data buffering, LUTs, and state storage.
  • High I/O Count  470 user I/O pins to support dense external connectivity and multi-interface designs.
  • Gate Density  513,000 gates reported for system-level logic and RAM implementations.
  • Package & Mounting  600-BGA (45×45) FineLine BGA-style package; surface-mount mounting for board-level integration and space-efficient layouts.
  • Power Supply  Operates with a supply range of 2.375 V to 2.625 V to match target system rails.
  • Commercial Temperature Grade  Rated for 0 °C to 70 °C operation for standard commercial environments.
  • On-board Test & Configuration  Series-level features include built-in JTAG boundary-scan test (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or JTAG.
  • Architectural Enhancements (series-level)  FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution options are available in the FLEX 10K family to support efficient arithmetic and high-fan-in logic implementations.

Typical Applications

  • Communications Equipment  Use the EPF10K200SBC600-1 for protocol bridging, data framing, and mid-range packet processing where near-10k logic elements and high I/O density are required.
  • Embedded System Integration  Implement custom control logic, peripheral interfaces, and glue logic using the device’s combination of logic elements and embedded RAM.
  • Test and Measurement  Deploy as a programmable logic engine for signal routing, data aggregation, and custom timing functions using its JTAG testability and flexible I/O.
  • Industrial Control (Commercial Environments)  Integrate control sequencing and interface logic in commercial-grade industrial equipment operating within the specified temperature range.

Unique Advantages

  • Balanced Logic and Memory  Nearly 10k logic elements combined with ~0.098 Mbits of embedded RAM lets you implement state machines, buffers, and control logic without immediate reliance on external memory.
  • High I/O Integration  470 I/Os enable consolidation of multiple interfaces and sensor/actuator connections, reducing board-level glue logic.
  • Compact, Board-Friendly Package  The 600-BGA (45×45) surface-mount package offers a high-pin-count solution while conserving PCB real estate.
  • Designed for In-System Configuration and Test  Built-in JTAG and support for external configuration devices facilitate programming, debugging, and boundary-scan testing without consuming device logic.
  • Vendor Series Features  FLEX 10K family capabilities such as dedicated carry/cascade chains and FastTrack interconnect support efficient implementation of arithmetic and high-fan-in functions.
  • RoHS Compliant  Meets RoHS requirements for lead-free assembly environments.

Why Choose EPF10K200SBC600-1?

The EPF10K200SBC600-1 provides a balanced mix of logic density, embedded memory, and I/O capacity in a compact 600-BGA package, making it well suited for mid-density programmable logic applications in commercial products. Its on-board testability and series-level architectural features support efficient design implementation and board-level integration.

This device is aimed at designers seeking a commercial-grade FPGA solution that combines reprogrammability with ample I/O and memory for protocol handling, embedded control, and system glue logic, backed by the FLEX 10K family’s configuration and interconnect capabilities.

Request a quote or submit an inquiry to get pricing and availability information for the EPF10K200SBC600-1. Our team can provide lead-time details and support for volume requirements.

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