EPF10K200SBC600-1
| Part Description |
FLEX-10KS® Field Programmable Gate Array (FPGA) IC 470 98304 9984 600-BGA |
|---|---|
| Quantity | 636 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 600-BGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 600-BGA | Number of I/O | 470 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1248 | Number of Logic Elements/Cells | 9984 | ||
| Number of Gates | 513000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 98304 |
Overview of EPF10K200SBC600-1 – FLEX-10KS® Field Programmable Gate Array (FPGA) 600-BGA
The EPF10K200SBC600-1 is a FLEX 10K series embedded programmable logic device (FPGA) in a 600-ball BGA package. It combines nearly 10,000 logic elements with a substantial on-chip memory footprint and a high IO count to address complex digital integration tasks.
Designed for commercial applications, this surface-mount FPGA offers a compact 45×45 600-BGA package, a supply range of 2.375 V to 2.625 V, and an operating temperature range of 0 °C to 70 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 9,984 logic elements suitable for implementing medium-density logic and control functions.
- On-chip Memory Approximately 0.098 Mbits (98,304 bits) of embedded RAM for data buffering, LUTs, and state storage.
- High I/O Count 470 user I/O pins to support dense external connectivity and multi-interface designs.
- Gate Density 513,000 gates reported for system-level logic and RAM implementations.
- Package & Mounting 600-BGA (45×45) FineLine BGA-style package; surface-mount mounting for board-level integration and space-efficient layouts.
- Power Supply Operates with a supply range of 2.375 V to 2.625 V to match target system rails.
- Commercial Temperature Grade Rated for 0 °C to 70 °C operation for standard commercial environments.
- On-board Test & Configuration Series-level features include built-in JTAG boundary-scan test (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or JTAG.
- Architectural Enhancements (series-level) FastTrack interconnect, dedicated carry and cascade chains, and low-skew clock distribution options are available in the FLEX 10K family to support efficient arithmetic and high-fan-in logic implementations.
Typical Applications
- Communications Equipment Use the EPF10K200SBC600-1 for protocol bridging, data framing, and mid-range packet processing where near-10k logic elements and high I/O density are required.
- Embedded System Integration Implement custom control logic, peripheral interfaces, and glue logic using the device’s combination of logic elements and embedded RAM.
- Test and Measurement Deploy as a programmable logic engine for signal routing, data aggregation, and custom timing functions using its JTAG testability and flexible I/O.
- Industrial Control (Commercial Environments) Integrate control sequencing and interface logic in commercial-grade industrial equipment operating within the specified temperature range.
Unique Advantages
- Balanced Logic and Memory Nearly 10k logic elements combined with ~0.098 Mbits of embedded RAM lets you implement state machines, buffers, and control logic without immediate reliance on external memory.
- High I/O Integration 470 I/Os enable consolidation of multiple interfaces and sensor/actuator connections, reducing board-level glue logic.
- Compact, Board-Friendly Package The 600-BGA (45×45) surface-mount package offers a high-pin-count solution while conserving PCB real estate.
- Designed for In-System Configuration and Test Built-in JTAG and support for external configuration devices facilitate programming, debugging, and boundary-scan testing without consuming device logic.
- Vendor Series Features FLEX 10K family capabilities such as dedicated carry/cascade chains and FastTrack interconnect support efficient implementation of arithmetic and high-fan-in functions.
- RoHS Compliant Meets RoHS requirements for lead-free assembly environments.
Why Choose EPF10K200SBC600-1?
The EPF10K200SBC600-1 provides a balanced mix of logic density, embedded memory, and I/O capacity in a compact 600-BGA package, making it well suited for mid-density programmable logic applications in commercial products. Its on-board testability and series-level architectural features support efficient design implementation and board-level integration.
This device is aimed at designers seeking a commercial-grade FPGA solution that combines reprogrammability with ample I/O and memory for protocol handling, embedded control, and system glue logic, backed by the FLEX 10K family’s configuration and interconnect capabilities.
Request a quote or submit an inquiry to get pricing and availability information for the EPF10K200SBC600-1. Our team can provide lead-time details and support for volume requirements.

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