EPF10K200EGC599-3

The EPF10K200EGC599-3 is a FLEX-10KE® Field Programmable Gate Array (FPGA) IC from Altera targeted for commercial embedded designs. It combines a substantial logic fabric with on-chip memory and high I/O density to address glue-logic, control, and moderate-complexity signal processing tasks.

With 9,984 logic elements, approximately 98.3 Kbits of embedded RAM, and 470 user I/O pins in a 599-BCPGA through-hole package, this device is intended for designers requiring a compact, board-integrated FPGA solution within a defined commercial temperature and supply range.

Key Features

• Logic Capacity — 9,984 logic elements and 1,248 LABs provide a scalable fabric for implementing combinational and sequential logic, finite-state machines, and moderate DSP pipelines.
• On‑chip Memory — Approximately 0.098 Mbits (98,304 bits) of embedded RAM for FIFOs, small buffers, and local data storage without external memory.
• I/O Density — 470 user I/O pins support broad connectivity for bus interfaces, sensor lines, and peripheral control.
• Gate Count — Approximately 513,000 gates for mapping diverse logic functions and control networks.
• Power and Voltage — Core supply range of 2.375 V to 2.625 V allowing predictable power budgeting and decoupling design within the specified window.
• Package & Mounting — 599-BCPGA (supplier package: 599-CPGA, 62.48 × 62.48 mm) in a through‑hole mounting format for robust board assembly and thermal mass.
• Commercial Grade — Rated for operation from 0 °C to 70 °C and RoHS compliant for standard commercial applications.

Typical Applications

• Embedded Control — Implement board-level controllers, bus bridges, and glue logic where moderate logic density and numerous I/Os are required.
• Prototyping & Evaluation — Use through-hole 599-BCPGA package for development platforms and evaluation boards that benefit from straightforward assembly and rework.
• Peripheral Interface — Concentrate I/O and on-chip RAM to handle parallel/serial interface aggregation, protocol conversion, and device interfacing.

Unique Advantages

• Substantial Logic Resource: Nearly 10k logic elements and 1,248 LABs enable integration of multiple functions on a single device, reducing external glue components.
• High I/O Count: 470 user I/Os provide flexibility to connect multiple peripherals, buses, and front-end interfaces without additional expanders.
• Embedded RAM: Approximately 98.3 Kbits of on-chip memory supports local buffering and small data structures, minimizing immediate external memory needs.
• Robust Package for Board Integration: 599-BCPGA through-hole package offers secure mounting and thermal mass suited to commercial PCBs and development fixtures.
• Predictable Power Envelope: Tight core supply range (2.375–2.625 V) simplifies power-supply design and component selection for stable operation.
• Compliance and Grade: RoHS compliant and specified for 0 °C to 70 °C operation, aligning with commercial product and development requirements.

Why Choose EPF10K200EGC599-3?

The EPF10K200EGC599-3 balances nearly 10k logic elements, significant I/O capacity, and embedded memory in a single 599-BCPGA through-hole package, making it suitable for commercial embedded designs that need board-level integration and moderate logic complexity. Its defined supply range and commercial temperature rating allow predictable system design and component selection.

This FPGA is well suited to engineers and teams building prototypes, control logic, and interface consolidation solutions that benefit from high pin count and on-chip resources while maintaining RoHS compliance and conventional commercial operating limits.

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