EPF10K200EFC672-2

The EPF10K200EFC672-2 is a commercial-grade FLEX-10KE field programmable gate array (FPGA) from Intel, provided in a 672‑ball BGA package. It combines a high logic element count with substantial embedded RAM and a large I/O complement to address complex programmable-logic applications that require dense integration in a surface-mount footprint.

As a member of the FLEX 10K family, the device is suited for designs that benefit from embedded array resources, flexible interconnect, and hardware reconfigurability while operating within a 2.3 V to 2.7 V supply window and a 0 °C to 70 °C commercial temperature range.

Key Features

• Logic Capacity — 9,984 logic elements (LEs) and approximately 513,000 gates support complex combinational and sequential logic designs.
• Logic Array Blocks (LABs) — 1,248 LABs for structured placement of logic resources and predictable routing.
• Embedded Memory — 98,304 total RAM bits of on-chip embedded memory for buffering, FIFOs, and small data tables.
• High I/O Density — 470 user I/O pins to interface with multiple peripherals, buses, and external devices.
• Power Supply — Operates from a 2.3 V to 2.7 V supply, enabling integration into systems with lower-voltage domains.
• Package & Mounting — 672‑BBGA (supplier package: 672‑FBGA, 27 × 27 mm) in a surface-mount form factor for compact board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operation for standard commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
• FLEX 10K Family Capabilities — As part of the FLEX 10K family, supports family-level features such as embedded arrays for megafunctions, JTAG boundary-scan, and flexible interconnect structures (series datasheet).

Typical Applications

• Communications and Networking — Implement protocol bridging, packet parsing, and custom interface logic using the device’s high I/O count and embedded memory.
• Storage and Buffering — Use on-chip RAM for temporary storage, FIFO buffering, and data-path staging in system designs.
• Custom Logic & Acceleration — Deploy custom arithmetic, control, or data-processing blocks using the available logic elements and LAB resources.
• Peripheral and Bus Interfaces — Integrate multiple peripheral interfaces or bespoke bus logic leveraging the device’s numerous I/O pins and programmable I/O behavior.

Unique Advantages

• High integration in a compact package: 9,984 logic elements and 470 I/Os in a 672‑BBGA reduce board area while enabling dense system integration.
• Substantial on-chip memory: 98,304 RAM bits provide local buffering and reduce dependence on external memory for many control and data-path tasks.
• Flexible supply compatibility: 2.3 V to 2.7 V operation supports integration into lower-voltage system domains.
• Commercial temperature suitability: Rated for 0 °C to 70 °C operation for standard commercial electronics deployments.
• RoHS compliance: Facilitates lead-free manufacturing and aligns with common environmental requirements.
• Family-level programmability: As a FLEX 10K family device, it benefits from architectural features such as embedded arrays and boundary-scan capabilities described in the family datasheet.

Why Choose EPF10K200EFC672-2?

The EPF10K200EFC672-2 positions itself as a capable, commercially graded FPGA for designers who need a balance of logic density, embedded memory, and large I/O capacity in a compact BGA package. Its 9,984 logic elements, 98,304 RAM bits, and 470 user I/Os make it suitable for mid- to high-complexity programmable-logic tasks where board space and pin count matter.

Choose this part when your design requires a FLEX 10K family FPGA offered by Intel that supports embedded memory usage, extensive I/O interfacing, and surface-mount board integration under standard commercial temperature and voltage conditions.

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