EPF10K200EFC672-3

The EPF10K200EFC672-3 is a FLEX-10KE family field programmable gate array designed for complex, high-pin-count digital designs. It combines a dense logic array with significant on-chip RAM and a broad I/O complement in a compact BGA package to support system-level integration and flexible board implementations.

This commercial-grade FPGA is suited to applications that require substantial logic resources, abundant I/O, and a small board footprint while operating within a 0 °C to 70 °C range and a 2.3 V to 2.7 V supply environment.

Key Features

• FPGA Core: Embedded programmable logic device architecture derived from the FLEX-10K family providing a reconfigurable fabric for custom logic functions.
• Logic Capacity: Approximately 9,984 logic elements paired with 1,248 LABs for implementing medium-to-high complexity logic designs.
• On-Chip Memory: Total RAM of 98,304 bits of embedded memory to support buffering, state storage, and memory-intensive logic functions.
• I/O Density: 470 user I/O pins to support rich interfacing and multiple parallel links or buses.
• Gate Equivalent: 513,000 gates of logic capacity for system-level combinational and sequential functions.
• Package & Mounting: 672-ball BGA package (672-BBGA / supplier package 672-FBGA, 27×27) with surface-mount mounting for compact board layouts.
• Power & Temperature: Voltage supply range of 2.3 V to 2.7 V and an operating temperature of 0 °C to 70 °C, targeted for commercial applications.
• Standards & Compliance: RoHS compliant to meet common environmental requirements for electronics manufacturing.

Typical Applications

• High-density logic integration: Implement complex custom logic, state machines, and data-path processing where a high count of logic elements and LABs is required.
• Memory-assisted processing: Use the embedded RAM to support buffering, FIFOs, and small on-chip data storage for signal processing or packet handling tasks.
• Multi-I/O interfaces: Deploy in systems that require many parallel interfaces, high-pin-count connectors, or multiplexed I/O lanes.
• Compact board designs: Ideal for space-constrained PCBs that benefit from the 672-BBGA package and surface-mount assembly.

Unique Advantages

• High logic density: Nearly 10k logic elements and over half a million gate equivalents enable substantial on-chip functionality without external logic.
• Significant embedded memory: 98,304 bits of RAM reduce dependency on external memory for many buffering and temporary storage tasks.
• Extensive I/O: 470 user I/Os facilitate rich peripheral connectivity and parallel data throughput options.
• Compact BGA package: 672-ball BGA (27×27) balances high pin count with board space efficiency for modern PCB layouts.
• Commercial qualification and RoHS compliance: Suitable for volume commercial products with environmental compliance for mainstream manufacturing.

Why Choose EPF10K200EFC672-3?

The EPF10K200EFC672-3 positions itself as a capable, compact FPGA for commercial designs that need substantial logic, embedded RAM, and a large I/O set in a space-efficient package. Its FLEX-10KE family heritage brings embedded programmable logic architecture suited for system-level integration.

This device is a solid choice for engineers building mid-to-high complexity digital systems where board space, I/O count, and on-chip memory are key design drivers. It delivers scalability and design flexibility for production-focused projects supported by the FLEX-10K family feature set.

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