EPF10K200EBC600-3

The EPF10K200EBC600-3 is a FLEX-10KE family field programmable gate array (FPGA) supplied in a 600-ball BGA (45×45 mm) surface-mount package. It delivers a high-density programmable fabric with 9,984 logic elements and on-chip RAM to support a wide range of custom digital designs.

Designed for commercial-grade applications, the device combines substantial I/O capacity with embedded memory and a compact BGA footprint, offering a balance of integration and board-level scalability for mid- to high-complexity FPGA implementations.

Key Features

• Logic Capacity  Provides 9,984 logic elements to implement custom digital functions and combinational/sequential logic structures.
• Configurable Logic Blocks (CLBs)  Contains 1,248 CLBs for structured logic partitioning and design organization.
• On-Chip Memory  Approximately 0.098 Mbits (98,304 bits) of embedded RAM for buffering, FIFOs, and temporary data storage close to the logic.
• High I/O Count  470 user I/O pins enable dense peripheral interfacing and multiple parallel bus connections.
• Power  Operates from a 2.3 V to 2.7 V supply range, suitable for systems using similar core supply rails.
• Package and Mounting  600-BGA (45×45) surface-mount package for compact, board-level integration with high pin density.
• Commercial Temperature Grade  Rated for 0 °C to 70 °C operation for typical commercial-environment deployments.
• RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

• Digital Logic Prototyping  Use the device’s 9,984 logic elements to prototype and validate custom digital architectures and control logic.
• High-Density I/O Control  470 I/O pins support complex interfacing tasks such as parallel buses, multiple peripherals, and board-level signal routing.
• On-Chip Data Buffering  Embedded RAM (98,304 bits) provides local buffering and temporary storage for data streams and packet processing.
• Compact System Integration  600-BGA package enables integration into space-constrained PCBs while preserving a large pin count for system-level connectivity.

Unique Advantages

• Substantial Logic Density: 9,984 logic elements allow implementation of complex combinational and sequential designs without immediate need for external logic.
• Large I/O Resource: 470 user I/Os simplify routing of multiple external interfaces and reduce the need for additional I/O expanders.
• On-Chip Memory for Throughput: Nearly 98 Kbits of embedded RAM supports buffering and state retention close to the logic, improving data handling efficiency.
• Compact, High-Pin Package: 600-BGA (45×45) delivers high pin count in a compact footprint for dense board designs.
• Commercial Temperature Suitability: Rated for 0 °C to 70 °C, aligning with typical commercial application environments.
• Regulatory Compliance: RoHS compliance supports restricted-substance requirements in commercial manufacturing.

Why Choose EPF10K200EBC600-3?

The EPF10K200EBC600-3 positions itself as a high-density, commercially graded FPGA solution that balances logic capacity, I/O flexibility, and on-chip memory within a compact 600-BGA package. Its 9,984 logic elements and 470 user I/Os make it well suited for mid- to high-complexity digital designs that require significant interfacing and local buffering.

Engineers and procurement teams will find value in the device’s integration level—reducing external component count—alongside a standard commercial operating range and RoHS compliance for mainstream product development and production environments.

Request a quote or submit an inquiry to receive pricing and availability for the EPF10K200EBC600-3 and to discuss how it can fit into your next FPGA design.