EPF10K200SBC356-2

The EPF10K200SBC356-2 is a FLEX-10KS family field programmable gate array (FPGA) packaged in a 356-LBGA (35 × 35) surface-mount form factor. It provides a programmable logic fabric with substantial I/O and on-chip memory capacity for system-level integration and embedded logic functions.

Designed for commercial-grade applications, this device combines 9,984 logic elements, approximately 98,304 bits of embedded RAM, and 274 user I/O pins with a low-voltage supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 70 °C.

Key Features

• Logic Capacity — 9,984 logic elements enabling implementation of complex combinational and sequential logic.
• Embedded Memory — Approximately 98,304 bits (~0.098 Mbits) of on-chip RAM for data buffering, state storage, and small embedded memories.
• I/O and Interfaces — 274 user I/O pins to support diverse peripheral connections and board-level interfacing in a single device.
• Gate Count — Approximately 513,000 total gates for broad functional mapping and integration.
• Power and Supply — Operates from a 2.375 V to 2.625 V supply window to meet targeted system voltage requirements.
• Package and Mounting — 356-LBGA package (356-BGA, 35 × 35) supplied as a surface-mount device for high-density PCB layouts.
• Commercial Temperature Grade — Specified for 0 °C to 70 °C operation for commercial environments.
• Design and Test Support (Series Features) — Series-level features include JTAG boundary-scan for in-circuit test, FastTrack interconnect for predictable routing delays, built-in low-skew clock distribution, and dedicated carry and cascade chains for arithmetic and high-fan-in logic functions.
• I/O Flexibility (Series Features) — Series-level programmable I/O features such as individual tri-state control, open-drain option, and programmable output slew-rate control to manage switching noise and interface behavior.
• Standards and Compliance — RoHS compliant material designation for environmental regulatory adherence.

Typical Applications

• System Integration and SOPC — Use the device to integrate control logic, custom accelerators, and on-chip memory into a consolidated programmable system.
• Interface Bridging and Protocol Glue — High I/O count supports implementing bus translators, protocol adapters, and multi-interface bridging on a single FPGA.
• Embedded Logic and Control — Deploy as a programmable controller for data handling, state machines, and custom peripheral management where reconfigurable logic is required.

Unique Advantages

• Significant Logic Density: 9,984 logic elements and ~513,000 gates enable compact implementation of complex logic without multiple discrete devices.
• On-Chip RAM for Tight Integration: Approximately 98,304 bits of embedded RAM reduce external memory dependency for small buffers and lookup tables.
• High I/O Count: 274 user I/O pins provide flexible board-level connectivity and reduce the need for external multiplexing.
• Compact, Surface-Mount BGA Package: 356-LBGA (35 × 35) supports high-density PCB layouts and streamlined assembly.
• Design and Test Features: Series-level JTAG boundary-scan, low-skew clock distribution, and dedicated arithmetic chains simplify development and system verification.
• RoHS Compliant: Meets environmental substance directives for easier regulatory alignment.

Why Choose EPF10K200SBC356-2?

The EPF10K200SBC356-2 delivers a balanced combination of logic capacity, on-chip RAM, and a large I/O complement in a compact 356-LBGA package for commercial embedded designs. Its FLEX-10K series design features—such as dedicated arithmetic chains, configurable I/O behavior, and JTAG boundary-scan—support efficient implementation, testing, and integration of system-level functionality.

This device is suited for teams implementing consolidated programmable logic solutions where board-space efficiency, reconfigurability, and moderate embedded memory are required. Its commercial temperature rating and RoHS compliance support a broad set of non-industrial applications with predictable supply and thermal profiles.

Request a quote or submit a purchasing inquiry to evaluate EPF10K200SBC356-2 for your next embedded logic design.