XC4VSX55-12FF1148C
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA |
|---|---|
| Quantity | 1,334 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 640 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 55296 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5898240 |
Overview of XC4VSX55-12FF1148C – Virtex®-4 SX FPGA, 1148-BBGA FCBGA
The XC4VSX55-12FF1148C is a Virtex®-4 SX Field Programmable Gate Array (FPGA) IC from AMD. It provides a high count of logic resources, on-chip memory, and a large I/O complement in a surface-mount FCBGA package suitable for commercial designs.
Key attributes include 55,296 logic elements, approximately 5.9 Mbits of embedded RAM (5,898,240 bits), 640 I/O, a 1148-ball BGA package, and a specified operating range of 0 °C to 85 °C. The device is RoHS compliant and designed for deployment where on-chip capacity and dense I/O are required.
Key Features
- Core / Logic Density — 55,296 logic elements (cells) to implement substantial digital logic and custom functions.
- Embedded Memory — Approximately 5.9 Mbits of on-chip RAM (5,898,240 bits) for data buffering and storage within the FPGA fabric.
- I/O Capability — 640 user I/O pins to support broad interfacing with external devices and subsystems.
- Package — 1148-BBGA, FCBGA package; supplier device package listed as 1148-FCPBGA (35×35), optimized for surface-mount assembly.
- Power — Core supply range specified from 1.14 V to 1.26 V for the FPGA core.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Mounting & Compliance — Surface mount device and RoHS compliant for regulatory and assembly requirements.
Unique Advantages
- High logic capacity: 55,296 logic elements enable implementation of complex FPGA designs without immediate need for external logic expansion.
- Substantial on‑chip memory: Approximately 5.9 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
- Extensive I/O: 640 I/O pins provide flexibility for dense connectivity and multi-channel interfaces.
- Dense BGA package: The 1148-ball FCBGA (1148-FCPBGA, 35×35) offers a compact footprint for surface-mount PCBA integration.
- Defined power window: Operation with a 1.14–1.26 V core supply supports designs targeting specific low-voltage power rails.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.
Why Choose XC4VSX55-12FF1148C?
The XC4VSX55-12FF1148C positions itself as a high-capacity Virtex®-4 SX FPGA from AMD, combining a substantial number of logic elements and embedded memory with a large I/O count in a compact FCBGA package. These attributes make it suitable for commercial designs that require on-chip resources and dense external interfacing in a surface-mount format.
For engineering teams and procurement focused on solutions with defined electrical and thermal specifications, this device offers clear, verifiable attributes—logic density, embedded RAM, I/O count, package details, supply range, and operating temperature—that support design planning and BOM decisions.
Request a quote or submit a sales inquiry to obtain pricing, availability, and additional purchasing information for the XC4VSX55-12FF1148C.

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