XC4VSX55-12FF1148C

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA

Quantity 1,334 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells55296
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5898240

Overview of XC4VSX55-12FF1148C – Virtex®-4 SX FPGA, 1148-BBGA FCBGA

The XC4VSX55-12FF1148C is a Virtex®-4 SX Field Programmable Gate Array (FPGA) IC from AMD. It provides a high count of logic resources, on-chip memory, and a large I/O complement in a surface-mount FCBGA package suitable for commercial designs.

Key attributes include 55,296 logic elements, approximately 5.9 Mbits of embedded RAM (5,898,240 bits), 640 I/O, a 1148-ball BGA package, and a specified operating range of 0 °C to 85 °C. The device is RoHS compliant and designed for deployment where on-chip capacity and dense I/O are required.

Key Features

  • Core / Logic Density — 55,296 logic elements (cells) to implement substantial digital logic and custom functions.
  • Embedded Memory — Approximately 5.9 Mbits of on-chip RAM (5,898,240 bits) for data buffering and storage within the FPGA fabric.
  • I/O Capability — 640 user I/O pins to support broad interfacing with external devices and subsystems.
  • Package — 1148-BBGA, FCBGA package; supplier device package listed as 1148-FCPBGA (35×35), optimized for surface-mount assembly.
  • Power — Core supply range specified from 1.14 V to 1.26 V for the FPGA core.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Mounting & Compliance — Surface mount device and RoHS compliant for regulatory and assembly requirements.

Unique Advantages

  • High logic capacity: 55,296 logic elements enable implementation of complex FPGA designs without immediate need for external logic expansion.
  • Substantial on‑chip memory: Approximately 5.9 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
  • Extensive I/O: 640 I/O pins provide flexibility for dense connectivity and multi-channel interfaces.
  • Dense BGA package: The 1148-ball FCBGA (1148-FCPBGA, 35×35) offers a compact footprint for surface-mount PCBA integration.
  • Defined power window: Operation with a 1.14–1.26 V core supply supports designs targeting specific low-voltage power rails.
  • Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose XC4VSX55-12FF1148C?

The XC4VSX55-12FF1148C positions itself as a high-capacity Virtex®-4 SX FPGA from AMD, combining a substantial number of logic elements and embedded memory with a large I/O count in a compact FCBGA package. These attributes make it suitable for commercial designs that require on-chip resources and dense external interfacing in a surface-mount format.

For engineering teams and procurement focused on solutions with defined electrical and thermal specifications, this device offers clear, verifiable attributes—logic density, embedded RAM, I/O count, package details, supply range, and operating temperature—that support design planning and BOM decisions.

Request a quote or submit a sales inquiry to obtain pricing, availability, and additional purchasing information for the XC4VSX55-12FF1148C.

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