XC4VSX55-11FF1148I

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA

Quantity 1,354 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells55296
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5898240

Overview of XC4VSX55-11FF1148I – Virtex®-4 SX FPGA, 1148-BBGA (Industrial)

The XC4VSX55-11FF1148I is a Virtex-4 SX Field Programmable Gate Array (FPGA) in an FCBGA package designed for industrial applications. It provides a high-density programmable fabric with 55,296 logic elements and approximately 5.898 Mbits of embedded memory for on-chip data storage and processing.

This device is specified for surface-mount assembly, operates from a 1.14 V to 1.26 V supply range, and supports an operating temperature range of −40 °C to 100 °C, making it suitable for temperature-demanding environments where industrial-grade components are required.

Key Features

  • Logic Capacity — 55,296 logic elements and 6,144 configurable logic blocks (CLBs) provide substantial programmable resources for complex digital designs.
  • Embedded Memory — Approximately 5.898 Mbits of on-chip RAM for local buffering, state storage, and fast data manipulation without external memory.
  • I/O Resources — 640 I/O pins to support extensive external connectivity and interfacing requirements.
  • Power and Voltage — Core voltage supply range of 1.14 V to 1.26 V for integration with regulated power domains.
  • Package and Mounting — 1148-ball BGA (1148-BBGA / 1148-FCPBGA) FCBGA package with a 35 × 35 mm supplier package footprint, optimized for surface-mount PCB assembly.
  • Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 55,296 logic elements enable implementation of large-scale digital functions on a single device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 5.898 Mbits of embedded RAM supports data buffering and memory-intensive functions without relying on external memory.
  • Extensive I/O count: 640 I/O pins provide flexibility for interfacing to multiple peripherals, sensors, and high-bandwidth connections.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally challenging environments.
  • Compact FCBGA package: 1148-ball FCBGA (35 × 35 mm) balances high pin count with a mountable surface-mount form factor for dense system integration.
  • Regulatory/environmental compliance: RoHS compliance facilitates use in regions and systems requiring restricted-substance conformance.

Why Choose XC4VSX55-11FF1148I?

The XC4VSX55-11FF1148I combines a high count of logic elements and CLBs with significant embedded RAM and a large I/O complement to support complex, high-density FPGA implementations. Its industrial temperature rating and surface-mount FCBGA packaging make it a strong choice for designs that demand robust, reliable programmable logic in temperature-variable environments.

This device is appropriate for development teams and OEMs seeking a scalable, on-chip integration platform that reduces external component count while providing the programmable capacity and I/O resources necessary for sophisticated digital systems. Its RoHS compliance and defined supply-voltage window simplify integration into regulated product designs.

Request a quote or submit an inquiry to start the procurement process for the XC4VSX55-11FF1148I.

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