XC4VSX55-11FFG1148I

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA

Quantity 734 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells55296
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5898240

Overview of XC4VSX55-11FFG1148I – Virtex®-4 SX FPGA, 55,296 logic elements, 640 I/O, 1148-BBGA (FCBGA)

The XC4VSX55-11FFG1148I is a Virtex-4 SX Field Programmable Gate Array (FPGA) in a 1148-ball FCBGA package designed for surface-mount applications. It delivers high logic density with 6,144 CLBs (55,296 logic elements), approximately 5.9 Mbits of embedded memory, and 640 user I/O pins for designs that require significant on-chip resources and extensive external connectivity.

Engineered for industrial environments, this device operates over a −40°C to 100°C temperature range and supports a core supply range of 1.14 V to 1.26 V, making it suitable for robust, temperature-tolerant system designs.

Key Features

  • Core Architecture  Virtex-4 SX FPGA family in an industrial-grade device, providing a programmable fabric for custom logic implementation.
  • Logic Resources  6,144 CLBs delivering a total of 55,296 logic elements to implement complex digital functions and state machines.
  • Embedded Memory  Approximately 5.9 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • I/O Capacity  640 user I/O pins to support broad peripheral and bus interfacing requirements.
  • Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and domain requirements.
  • Package & Mounting  1148-BBGA (FCBGA) package, supplier device package 1148-FCPBGA (35×35), designed for surface-mount assembly.
  • Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C for demanding temperature environments.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 55,296 logic elements enable implementation of large FPGA designs without external logic components.
  • Substantial on-chip memory: Approximately 5.9 Mbits of embedded RAM reduces the need for external memory in many buffering and data-path use cases.
  • Extensive connectivity: 640 I/O pins provide flexibility for parallel interfaces, multiple buses, and mixed-signal board layouts.
  • Industrial temperature range: Rated for −40°C to 100°C, supporting deployment in temperature-sensitive environments.
  • Compact FCBGA package: 1148-ball FCBGA (35×35) balances high pin count with a compact board footprint for space-constrained systems.

Why Choose XC4VSX55-11FFG1148I?

The XC4VSX55-11FFG1148I positions itself as a high-capacity, industrial-grade FPGA option offering a combination of substantial logic resources, on-chip memory, and broad I/O in a compact FCBGA package. Its specified operating voltage and extended temperature range make it suitable for designs that demand reliable operation across varied environmental conditions.

This device is well suited for engineers and teams building systems that require high integration of logic and memory with a large number of external interfaces, providing a platform that supports complex and scalable digital designs.

Request a quote or submit an inquiry today to evaluate the XC4VSX55-11FFG1148I for your next FPGA-based design.

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