XC4VSX55-10FFG1148I

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA

Quantity 592 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells55296
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5898240

Overview of XC4VSX55-10FFG1148I – Virtex®-4 SX Field Programmable Gate Array (1148-BBGA)

The XC4VSX55-10FFG1148I is a Virtex-4 SX Field Programmable Gate Array (FPGA) from AMD. It provides a large array of programmable logic and on-chip memory resources for custom digital designs.

Key device attributes include 6,144 configurable logic blocks (CLBs) supporting 55,296 logic elements, approximately 5.9 Mbits of embedded memory, and 640 I/O pins. The device is supplied in a 1148-BBGA FCBGA package (supplier package 1148-FCPBGA, 35×35 mm), supports a 1.14 V to 1.26 V supply range, operates from -40 °C to 100 °C, and is RoHS compliant.

Key Features

  • Core Logic  6,144 configurable logic blocks (CLBs) and 55,296 logic elements provide substantial programmable logic resources for implementing custom digital functions.
  • Embedded Memory  Approximately 5.9 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
  • I/O Resources  640 available I/O pins to support dense connectivity and interfacing requirements.
  • Power  Operates from a 1.14 V to 1.26 V supply range, matching tightly controlled core voltage requirements.
  • Package & Mounting  1148-BBGA FCBGA package (supplier package 1148-FCPBGA, 35×35 mm) with surface-mount mounting for compact, high-pin-count board designs.
  • Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
  • Compliance  RoHS compliant material and manufacturing status.

Typical Applications

  • Industrial Control Systems  Leverages the industrial temperature rating and robust logic resources for custom control, sequencing, and interfacing tasks.
  • Signal Processing and Custom Logic  On-chip memory and extensive logic elements enable implementation of buffering, state machines, and algorithmic pipelines.
  • High-density I/O Systems  640 I/O pins support dense sensor, actuator, or peripheral interfacing in complex systems.
  • Board-level Integration  Compact 1148-BBGA package and surface-mount mounting simplify integration into space-constrained, high-pin-count PCBs.

Unique Advantages

  • Substantial programmable logic capacity: 55,296 logic elements and 6,144 CLBs enable implementation of complex, custom digital designs without external logic.
  • Significant on-chip memory: Approximately 5.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and state storage needs.
  • Large I/O complement: 640 I/O pins provide flexibility for multi-channel interfaces and dense connectivity requirements.
  • Industrial temperature support: Rated from -40 °C to 100 °C for use in demanding environmental conditions.
  • High-pin-count, compact package: 1148-BBGA FCBGA (35×35 mm) supports high-density board layouts while keeping the solution compact.
  • RoHS compliant: Meets restricted substances requirements for regulated markets.

Why Choose XC4VSX55-10FFG1148I?

The XC4VSX55-10FFG1148I combines a high count of logic elements, substantial embedded memory, and a large I/O complement in a compact BGA package, positioning it for designs that require dense programmable logic and extensive interfacing. Its industrial temperature rating and RoHS compliance support deployment in temperature-challenging and regulated environments.

This device is well suited for engineering teams building complex, I/O-intensive digital systems that demand on-chip memory and a compact board footprint. Its voltage and package characteristics aid straightforward integration into controlled-power, surface-mount designs.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the XC4VSX55-10FFG1148I.

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