XC4VSX35-12FFG668C

The XC4VSX35-12FFG668C is a commercial-grade Virtex®-4 SX field programmable gate array (FPGA) supplied in a 668-ball FCBGA package. It combines a large logic capacity with substantial embedded RAM and a high I/O count to address complex, programmable digital designs.

With 34,560 logic elements, approximately 3.5 Mbits of on-chip memory and up to 448 I/O, this device is targeted at applications that require dense programmable logic, significant local storage, and extensive connectivity while operating within a 1.14–1.26 V supply window and a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  34,560 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM for data buffering, state storage and local memory-intensive tasks.
• I/O Density  Up to 448 I/O pins to support extensive external interfacing and multiple parallel connections.
• Package and Mounting  668-ball FCBGA package (supplier device package: 668-FCBGA (27×27)) for high-density board integration; surface-mount mounting type.
• Power  Operates from a 1.14 V to 1.26 V supply range, enabling designs with specific core voltage requirements.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C to match standard commercial electronic environments.
• Regulatory Compliance  RoHS compliant for use in assemblies requiring lead-free components.

Typical Applications

• High-density digital systems  Implement custom processing pipelines and control logic using the device’s large logic element count and on-chip memory.
• I/O-intensive interface bridging  Use the 448 I/O pins to connect multiple peripherals, buses or parallel interfaces in a single FPGA solution.
• Embedded memory buffering  Leverage approximately 3.5 Mbits of embedded RAM for local data buffering, packet handling or temporary storage.
• Commercial embedded platforms  Deploy in commercial-grade products that require flexible programmable logic and robust board-level integration.

Unique Advantages

• Substantial logic resources: 34,560 logic elements provide room for complex custom logic and parallel processing implementations.
• Significant embedded memory: Approximately 3.5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage tasks.
• High I/O capacity: Up to 448 I/O pins simplify system integration by reducing the need for external multiplexing or I/O expanders.
• Compact, high-density package: The 668-FCBGA (27×27) package enables high-density board designs while supporting surface-mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and environments.
• RoHS compliant: Conforms to lead-free assembly requirements for regulatory and environmental considerations.

Why Choose XC4VSX35-12FFG668C?

The XC4VSX35-12FFG668C positions itself as a versatile, commercial-grade FPGA for designs that require a balance of logic capacity, embedded memory and extensive I/O. Its combination of 34,560 logic elements, approximately 3.5 Mbits of on-chip RAM and up to 448 I/O supports a wide range of programmable digital functions while simplifying board-level integration with a 668-FCBGA package.

For teams building commercial embedded systems, interface-rich designs or memory-buffered logic blocks, this Virtex®-4 SX device offers a scalable, RoHS-compliant option that aligns with standard voltage and temperature requirements while enabling compact, high-density implementations.

Request a quote or submit an inquiry to receive pricing and availability for the XC4VSX35-12FFG668C for your next design.