XC4VSX35-12FF668C

The XC4VSX35-12FF668C is a Virtex®-4 SX field programmable gate array (FPGA) from AMD supplied in a 668-FCBGA package. It delivers a programmable logic fabric with substantial on-chip memory and a high I/O count for complex digital designs.

Targeted at commercial-grade applications, this surface-mount FPGA provides a balance of logic capacity, embedded memory, and I/O density within a 27 × 27 mm 668-FCBGA footprint.

Key Features

• Programmable Logic  34,560 logic elements provide the programmable fabric needed for custom digital functions and hardware acceleration.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Density  448 user I/O pins enable high pin-count interfaces and connectivity for multi-channel designs.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and support power budgeting in board designs.
• Package and Mounting  668-FCBGA (27 × 27 mm) package, surface-mount mounting type for compact PCB integration.
• Operating Range and Grade  Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental compatibility.
• Manufacturer  Device manufactured by AMD and supplied in a 668-BBGA/FCBGA package case for consistent package form factor.

Typical Applications

• FPGA-based prototyping  Use the programmable logic and on-chip memory to validate hardware architectures and iterate RTL quickly.
• High-density I/O systems  Leverage 448 I/O pins to implement multi-channel interfaces, parallel buses, or complex peripheral routing.
• Embedded acceleration  Allocate logic elements and embedded RAM to offload computation and buffering tasks within a commercial embedded product.
• Compact board designs  The 27 × 27 mm 668-FCBGA package and surface-mount mounting support space-constrained PCB layouts.

Unique Advantages

• Substantial logic capacity: 34,560 logic elements provide headroom for complex logic functions and moderately sized designs without external logic chips.
• Integrated memory resources: Approximately 3.5 Mbits of embedded RAM reduce reliance on external memory for buffering and local storage.
• High connectivity: 448 I/O pins enable direct interfacing to multiple peripherals, sensors, or data channels, simplifying board-level routing.
• Compact FCBGA packaging: The 668-FCBGA (27 × 27 mm) footprint supports dense PCB integration while maintaining a high pin count.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial applications and operating environments.
• RoHS compliant: Meets RoHS requirements for environmental compliance in commercial products.

Why Choose XC4VSX35-12FF668C?

The XC4VSX35-12FF668C combines a significant logic element count, substantial on-chip RAM, and a large number of I/O pins in a compact 668-FCBGA package, making it a practical choice for commercial designs requiring programmable logic, embedded memory, and high connectivity. Its 1.14 V–1.26 V core supply range and surface-mount FCBGA form factor simplify integration into modern PCB designs.

This FPGA is well suited to designers and teams building commercial embedded systems, prototyping new hardware architectures, or consolidating discrete functions into a single programmable device while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the XC4VSX35-12FF668C.