XC4VSX35-11FFG668C

The XC4VSX35-11FFG668C is a Virtex-4 SX Field Programmable Gate Array (FPGA) provided in a 668-FCBGA package. It delivers a high-density logic fabric with substantial embedded memory and a large I/O count for applications that require complex, customizable digital logic and extensive interfacing.

With 3,840 CLBs and 34,560 logic elements, approximately 3.5 Mbits of on-chip RAM and 448 I/O pins, this device is suited to designs that demand dense logic resources, significant local memory, and broad connectivity while operating within a commercial temperature range.

Key Features

• Core Logic — 3,840 CLBs providing 34,560 logic elements for implementing complex programmable logic and control functions.
• Embedded Memory — Approximately 3.5 Mbits of on-chip RAM available for buffering, FIFOs, and local data storage.
• I/O Capacity — 448 user I/O pins enable wide parallel interfaces and multi-protocol connectivity for dense system integration.
• Package & Mounting — 668-FCBGA (27×27 mm) ball-grid array in a surface-mount form factor for high pin-count, space-efficient board designs.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power-rail requirements.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for lead-free assembly and environmental requirements.

Typical Applications

• High-density digital logic — Implement custom control, state machines, and complex logic pipelines using the large CLB and logic element count.
• On-chip buffering and memory-heavy functions — Leverage approximately 3.5 Mbits of embedded RAM for local data storage, buffering, and temporary data manipulation.
• I/O‑intensive interface hubs — Use the 448 I/O pins to aggregate and bridge multiple parallel or serial interfaces on a single device.
• Prototype and system integration — Compact 668-FCBGA package and surface-mount mounting support dense board-level integration during prototyping and production.

Unique Advantages

• High logic density: 3,840 CLBs and 34,560 logic elements provide the capacity to consolidate complex functions into one programmable device, reducing board-level component count.
• Substantial embedded memory: Approximately 3.5 Mbits of on-chip RAM minimizes external memory dependence for many streaming and buffering tasks.
• Large I/O complement: 448 I/O pins enable broad connectivity and direct interfacing to multiple subsystems without added multiplexing.
• Compact, high‑pin package: 668-FCBGA (27×27) offers high pin density in a surface-mount form factor suited to space-constrained designs.
• Design-grade assurance: Commercial temperature rating (0 °C to 85 °C) and RoHS compliance support standard production and environmental requirements.
• Controlled core power range: Core supply specification of 1.14 V to 1.26 V provides clear guidance for power-supply design and board-level integration.

Why Choose XC4VSX35-11FFG668C?

The XC4VSX35-11FFG668C balances high logic resource counts, considerable embedded memory, and extensive I/O in a single Virtex-4 SX FPGA package, making it a strong candidate for designs that need consolidated digital logic and dense interfacing. Its surface-mount 668-FCBGA package supports compact board layouts while the defined core voltage and commercial operating range simplify system power and thermal planning.

This device is appropriate for engineers and teams building complex programmable logic solutions that prioritize integration, local memory capacity, and I/O density. Its specifications support scalable designs and help reduce external component count, aiding streamlined system implementation and maintainable hardware architectures.

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