XC4VSX35-10FFG668C

The XC4VSX35-10FFG668C is a Virtex®-4 SX Field Programmable Gate Array (FPGA) integrated circuit from AMD, delivered in a 668-ball FCBGA package. It provides a balanced combination of core logic capacity, embedded memory, and high I/O density for programmable logic designs.

This commercial-grade, RoHS-compliant device offers 34,560 logic elements, approximately 3.54 Mbits of embedded memory, and 448 I/O pins. It operates from a 1.14 V to 1.26 V supply and is specified for operation between 0 °C and 85 °C, mounted as a surface-mount 668-FCBGA (27×27) package.

Key Features

• Core Logic  Offers 34,560 logic elements to implement complex programmable logic and control functions.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic tasks.
• I/O Density  448 I/O pins provide extensive external connectivity for parallel interfaces, buses, and multi-channel designs.
• Package & Mounting  668-FCBGA (27×27) package, surface-mount, suitable for compact board-level integration where high pin count is required.
• Power  Nominal core supply range of 1.14 V to 1.26 V for predictable power budgeting in system designs.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS-compliant for environmental conformity.

Typical Applications

• Programmable logic and system integration  Deploy the FPGA to implement custom digital logic, control paths, and glue logic where significant logic capacity is required.
• Memory-intensive logic functions  Use the approximately 3.54 Mbits of embedded RAM for buffering, FIFO structures, and on-chip data storage.
• High-density I/O interfacing  Take advantage of 448 I/Os for multi-channel interfaces, bus bridging, or expansive peripheral connectivity.
• Compact board-level designs  The 668-FCBGA surface-mount package supports high-pin-count implementations in space-constrained layouts.

Unique Advantages

• High logic capacity: 34,560 logic elements enable implementation of sizable programmable designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 3.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Large I/O count: 448 I/Os simplify external connectivity, reducing the need for additional interface components.
• Compact high-density package: The 668-FCBGA (27×27) delivers high pin count in a package suitable for dense board layouts.
• Predictable power envelope: Defined supply range of 1.14 V to 1.26 V supports accurate power planning and thermal considerations.
• Commercial grade and RoHS-compliant: Meets standard commercial temperature requirements and environmental compliance for mainstream electronics.

Why Choose XC4VSX35-10FFG668C?

The XC4VSX35-10FFG668C positions itself as a versatile programmable logic device combining substantial logic resources, significant embedded memory, and a high I/O count within a compact 668-FCBGA surface-mount package. Its specifications support a wide range of board-level designs that require integrated logic, memory, and connectivity while operating within commercial temperature limits.

This FPGA is suited for design teams and procurement groups seeking a RoHS-compliant, commercial-grade Virtex®-4 SX device with clearly defined electrical and mechanical parameters—making it appropriate for scalable development, integration, and production where the provided logic capacity, memory, and I/O density match system requirements.

Request a quote or submit a purchase inquiry for the XC4VSX35-10FFG668C to receive pricing and availability information tailored to your project requirements.