XC4VSX25-11FF668I

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 320 2359296 23040 668-BBGA, FCBGA

Quantity 1,147 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells23040
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2359296

Overview of XC4VSX25-11FF668I – Virtex®-4 SX FPGA, 23,040 Logic Elements, 320 I/Os

The XC4VSX25-11FF668I is a Virtex®-4 SX field programmable gate array (FPGA) IC that combines substantial logic capacity with on-chip memory and a high I/O count. With 23,040 logic elements and approximately 2.36 Mbits of embedded RAM, it is designed for applications that require extensive programmable logic, local memory buffering, and dense external interfacing.

Offered in a 668-FCBGA (27×27) surface-mount package and rated for industrial operation from –40 °C to 100 °C, this device supports designs where board space, I/O density, and reliable operation across wide temperature ranges are important.

Key Features

  • Logic Capacity 23,040 logic elements provide a sizable fabric for implementing complex digital logic and custom processing pipelines.
  • Configurable Logic Blocks A substantial array of configurable logic provides flexible resource allocation for a variety of designs.
  • Embedded Memory Approximately 2.36 Mbits of on-chip RAM support local data buffering, FIFOs, and intermediate storage without external memory.
  • I/O Density 320 user I/Os enable high-pin-count interfacing to peripherals, sensors, and other system components.
  • Package & Mounting 668-FCBGA (27×27) / 668-BBGA package in a surface-mount form factor for compact board-level integration.
  • Power Core voltage supplied in the range of 1.14 V to 1.26 V for defined operating conditions.
  • Industrial Temperature Range Rated for operation from –40 °C to 100 °C to meet industrial deployment requirements.
  • Compliance RoHS compliant for environmental and materials considerations.

Typical Applications

  • Industrial Control Leverages industrial temperature rating and robust logic resources for control, sequencing, and real-time processing in factory and process environments.
  • High-Density I/O Systems Uses the 320 I/Os to connect multiple sensors, actuators, and external interfaces in compact systems.
  • On-Chip Data Buffering Employs approximately 2.36 Mbits of embedded RAM for local buffering, packet staging, or intermediate data storage within streaming or packetized designs.
  • Custom Logic and Acceleration Provides 23,040 logic elements for implementing application-specific datapaths, protocol handling, and hardware acceleration functions.

Unique Advantages

  • High Logic Density: 23,040 logic elements enable implementation of complex functions without external ASICs, reducing system BOM.
  • Substantial On-Chip Memory: Approximately 2.36 Mbits of embedded RAM allow meaningful local data storage to reduce external memory dependence and latency.
  • Extensive Connectivity: 320 I/Os support multiple parallel interfaces and high pin-count peripheral integration on a single device.
  • Industrial-Rated Operation: –40 °C to 100 °C range supports deployments in temperature-challenging environments.
  • Compact, Surface-Mount Package: 668-FCBGA (27×27) package conserves board area while providing high pin density for complex designs.
  • Regulatory Compliance: RoHS compliance simplifies material planning and environmental compliance for manufactured products.

Why Choose XC4VSX25-11FF668I?

The XC4VSX25-11FF668I positions itself as a capable Virtex®-4 SX FPGA option for designs demanding a balance of logic capacity, embedded memory, and high I/O count in a compact surface-mount package. Its industrial temperature rating and defined core voltage range help ensure predictable behavior across challenging environmental conditions.

This device is well suited for teams and projects that require on-chip resources for buffering and custom logic, substantial external interfacing, and a minimized board footprint—delivering a scalable and robust building block for industrial and high-density I/O applications.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time details for the XC4VSX25-11FF668I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up