XC4VSX35-10FF668C
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 448 3538944 34560 668-BBGA, FCBGA |
|---|---|
| Quantity | 216 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 448 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 34560 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC4VSX35-10FF668C – Virtex®-4 SX Field Programmable Gate Array (FPGA) IC, 668-FCBGA
The XC4VSX35-10FF668C is a Virtex®-4 SX field programmable gate array from AMD designed for programmable digital logic integration. It combines a large logic fabric with embedded memory and a high pin count to support complex custom logic implementations.
With 34,560 logic elements, approximately 3.54 Mbits of embedded memory and 448 I/O, this surface-mount FCBGA device targets designs that require substantial on-chip resources within a commercial-temperature range.
Key Features
- Logic Capacity — 34,560 logic elements organized across 3,840 CLBs provide a substantial logic fabric for implementing complex digital functions.
- Embedded Memory — Approximately 3.54 Mbits of on-chip RAM for buffering, state storage, and implemented algorithms that require local memory.
- I/O Density — 448 I/O pins to support wide parallel interfaces, multiple peripheral connections, or high-channel-count designs.
- Power — Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling integration into designs with specified power rails.
- Package and Mounting — Available in a 668-FCBGA (27 × 27) package and intended for surface-mount assembly to suit compact PCB layouts.
- Operating Range — Commercial-grade operating temperature of 0 °C to 85 °C for standard temperature environments.
- Compliance — RoHS compliant.
Typical Applications
- Custom Digital Logic and Prototyping — Use the 34,560 logic elements and 3,840 CLBs to implement and iterate complex custom architectures on a single device.
- Embedded Memory-Intensive Functions — Approximately 3.54 Mbits of embedded RAM supports on-chip buffering, lookup tables, and state machines without external memory.
- High-Channel I/O Designs — 448 I/O pins enable wide parallel buses, multi-channel interfaces, or dense peripheral connectivity directly from the FPGA package.
Unique Advantages
- High Logic Integration: 34,560 logic elements and 3,840 CLBs reduce the need for multiple discrete devices by consolidating complex logic on-chip.
- Substantial On‑Chip Memory: Approximately 3.54 Mbits of embedded RAM simplifies designs that require local data storage and fast access without external memory.
- Wide I/O Capability: 448 configurable I/Os provide flexibility for interfacing to numerous peripherals and system buses.
- Compact FCBGA Packaging: The 668-FCBGA (27 × 27) package supports high-density PCB implementations while keeping the device surface-mount compatible.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match standard commercial-environment applications.
- RoHS Compliant: Meets environmental compliance requirements for lead-free assemblies.
Why Choose XC4VSX35-10FF668C?
The XC4VSX35-10FF668C positions itself as a resource-rich Virtex®-4 SX FPGA suited for designers who need substantial logic capacity, embedded memory, and high I/O density in a single, surface-mount package. Its combination of 34,560 logic elements, approximately 3.54 Mbits of on-chip RAM, and 448 I/O pins supports compact, integrated implementations of complex digital systems within commercial temperature ranges.
This device is appropriate for development teams and system designers seeking a scalable, single-chip solution to consolidate logic, memory, and I/O, reducing board-level complexity while maintaining clear electrical and thermal operating parameters.
Request a quote or submit an inquiry to obtain pricing and availability for the XC4VSX35-10FF668C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








