XC4VSX25-10FFG668I

The XC4VSX25-10FFG668I is a Virtex®-4 SX field programmable gate array (FPGA) in a 668-ball FCBGA package. It provides a blend of configurable logic resources, embedded memory, and a large number of I/O for programmable digital designs.

With 2,560 configurable logic blocks (CLBs) corresponding to 23,040 logic elements and approximately 2.36 Mbits of embedded memory, this industrial-grade device supports designs that require significant on-chip logic and memory capacity within a 668-BBGA footprint.

Key Features

• Logic Capacity  2,560 configurable logic blocks (CLBs) delivering 23,040 logic elements for implementing complex programmable logic functions.
• Embedded Memory  Approximately 2.36 Mbits of on-chip RAM to support data buffering, FIFOs, and scratchpad storage within the FPGA fabric.
• I/O Density  320 I/O pins to interface with multiple peripherals, buses, or external devices without immediate need for external I/O expansion.
• Package and Mounting  668-ball FCBGA (27×27) package in a 668-BBGA footprint designed for surface-mount assembly.
• Power  Core voltage range from 1.14 V to 1.26 V to match system power rails and regulator designs.
• Operating Range  Industrial operating temperature range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Programmable Digital Processing  Use where custom digital logic implementations require up to 23,040 logic elements and significant on-chip RAM for intermediate data storage.
• I/O-Intensive Systems  Suitable for designs that need a large number of external interfaces, leveraging the 320 I/O pins for connectivity to sensors, memory, or peripheral devices.
• Embedded Memory-Centric Designs  Applications that need embedded RAM resources for buffering, packet processing, or data staging can take advantage of approximately 2.36 Mbits of on-chip memory.
• Industrial Electronics  Designed for industrial temperature operation (−40 °C to 100 °C) and surface-mount assembly in ruggedized systems.

Unique Advantages

• High Logic Density: 23,040 logic elements provide substantial capacity for implementing complex state machines, datapaths, and control logic within a single device.
• On-Chip Memory Availability: Approximately 2.36 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching needs, simplifying board design.
• Extensive I/O Count: 320 I/O pins enable broad interfacing options without immediate need for external I/O expanders, lowering BOM complexity.
• Industry-Grade Thermal Range: Operation from −40 °C to 100 °C supports deployment in temperature-variable industrial environments.
• Compact BGA Package: 668-FCBGA (27×27) delivers a high-pin-count solution in a compact surface-mount package suitable for dense board layouts.
• Regulatory Compliance: RoHS compliance facilitates use in regions and designs where lead-free components are required.

Why Choose XC4VSX25-10FFG668I?

The XC4VSX25-10FFG668I positions itself as a flexible FPGA option for designers needing a combination of substantial logic resources, embedded memory, and a large I/O count in an industrial-temperature-rated, surface-mount BGA package. Its specified core voltage range and RoHS compliance align with modern system power and regulatory requirements.

This device is well suited for teams developing complex programmable logic systems that require on-chip memory and high I/O density while operating across a wide temperature range. The package and specifications support scalable designs where integration, thermal performance, and board-area efficiency matter.

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