XC4VSX25-10FF668I

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 320 2359296 23040 668-BBGA, FCBGA

Quantity 13 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells23040
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2359296

Overview of XC4VSX25-10FF668I – Virtex®-4 SX FPGA, 320 I/Os, approximately 2.36 Mbits RAM, 23,040 logic elements, 668-FCBGA

The XC4VSX25-10FF668I is a Virtex®-4 SX field programmable gate array (FPGA) manufactured by AMD. It provides a balance of logic capacity, on-chip memory and high I/O count in a compact 668-ball FCBGA package for industrial-grade designs.

With 23,040 logic elements, approximately 2.36 Mbits of embedded memory and 320 I/Os, this device is intended for applications that require significant programmable logic, substantial embedded RAM and robust temperature performance in a surface-mount FCBGA footprint.

Key Features

  • Logic Capacity  23,040 logic elements enable implementation of complex digital functions and custom logic architectures.
  • Embedded Memory  Approximately 2.36 Mbits of on-chip RAM for buffering, packet storage and local data processing.
  • I/O and Integration  320 user I/Os support extensive external interfacing and system integration in a single device.
  • Power Supply  Core voltage range from 1.14 V to 1.26 V to match platform power rails and design requirements.
  • Package and Mounting  668-ball FCBGA package (supplier device package: 668-FCBGA, 27×27 mm) designed for surface-mount assembly.
  • Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C, suitable for extended-temperature industrial environments.
  • RoHS Compliance  Device is RoHS compliant for lead-free manufacturing processes.

Unique Advantages

  • High programmable logic density: 23,040 logic elements provide capacity for complex control, signal processing and custom acceleration tasks.
  • Substantial on-chip memory: Approximately 2.36 Mbits of embedded RAM reduce external memory dependency and improve latency for local data storage.
  • Large I/O complement: 320 I/Os simplify system-level integration by supporting multiple interfaces and parallel connections from a single FPGA.
  • Industrial temperature rating: −40 °C to 100 °C operation helps maintain functionality across a wide range of environmental conditions.
  • Compact FCBGA packaging: 668-ball, 27×27 mm FCBGA package enables dense board layouts while supporting robust soldered mounting.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC4VSX25-10FF668I?

This Virtex®-4 SX FPGA is positioned for designs that require a combination of significant programmable logic, ample on-chip RAM and a high I/O count within an industrial-temperature, surface-mount FCBGA package. The device’s specifications make it suitable for systems where integrated memory and I/O capacity reduce external component counts and simplify board-level design.

Choose the XC4VSX25-10FF668I when your project demands a robust, industrial-grade FPGA platform with clear electrical, thermal and packaging characteristics to support medium-to-high complexity programmable logic implementations.

Request a quote or submit an inquiry for pricing and availability for the XC4VSX25-10FF668I. Our team can provide details on lead times and order quantities to support your design schedule.

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