XC4VSX25-11FF668C
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 320 2359296 23040 668-BBGA, FCBGA |
|---|---|
| Quantity | 1,135 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 320 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2560 | Number of Logic Elements/Cells | 23040 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2359296 |
Overview of XC4VSX25-11FF668C – Virtex®-4 SX FPGA, 668-FCBGA (27×27)
The XC4VSX25-11FF668C is a Virtex-4 SX field programmable gate array (FPGA) in a 668-ball fine-pitch ceramic BGA package. It combines a substantial amount of configurable logic, embedded memory, and I/O capacity in a commercial-grade, surface-mount FCBGA footprint for programmable digital designs.
This device targets applications that require on-chip logic density, embedded RAM, and broad I/O capability while operating within standard commercial temperature and supply ranges.
Key Features
- Logic Capacity 2,560 configurable logic blocks (CLBs) delivering 23,040 logic elements for implementing complex digital functions.
- Embedded Memory Approximately 2.36 Mbits of on-chip RAM to support buffering, packet processing, and state storage.
- I/O Resources 320 I/O pins to interface with a wide range of peripherals, buses, and external devices.
- Power and Supply Core voltage range of 1.14 V to 1.26 V for the device core supply requirements.
- Package and Mounting 668-FCBGA package (27×27 mm) in a surface-mount form factor for compact, high-density board designs.
- Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance RoHS-compliant construction to meet common environmental requirements.
Unique Advantages
- Substantial on-chip logic: 23,040 logic elements provide room for sizeable custom logic blocks and system-level integration without immediate reliance on external logic devices.
- Integrated embedded RAM: Approximately 2.36 Mbits of on-chip memory reduce external memory requirements for intermediate buffering and local storage.
- High I/O count: 320 I/Os enable broad connectivity options for parallel interfaces, multi-channel designs, and mixed I/O subsystems.
- Compact high-density package: The 668-FCBGA (27×27) package supports compact PCB layouts while delivering significant I/O and logic resources.
- Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in standard commercial environments.
- Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.
Why Choose XC4VSX25-11FF668C?
The XC4VSX25-11FF668C delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact FCBGA package suitable for commercial-grade programmable designs. Its specification set supports integration of significant custom logic and on-chip buffering while maintaining a low-profile surface-mount footprint.
This device is appropriate for engineering teams and procurement focused on scalable FPGA-based implementations that require measurable on-chip resources, broad interfacing capability, and standard commercial operating conditions.
Request a quote or submit an inquiry to get pricing and availability details for the XC4VSX25-11FF668C.

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