XC4VSX25-11FF668C

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 320 2359296 23040 668-BBGA, FCBGA

Quantity 1,135 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells23040
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2359296

Overview of XC4VSX25-11FF668C – Virtex®-4 SX FPGA, 668-FCBGA (27×27)

The XC4VSX25-11FF668C is a Virtex-4 SX field programmable gate array (FPGA) in a 668-ball fine-pitch ceramic BGA package. It combines a substantial amount of configurable logic, embedded memory, and I/O capacity in a commercial-grade, surface-mount FCBGA footprint for programmable digital designs.

This device targets applications that require on-chip logic density, embedded RAM, and broad I/O capability while operating within standard commercial temperature and supply ranges.

Key Features

  • Logic Capacity  2,560 configurable logic blocks (CLBs) delivering 23,040 logic elements for implementing complex digital functions.
  • Embedded Memory  Approximately 2.36 Mbits of on-chip RAM to support buffering, packet processing, and state storage.
  • I/O Resources  320 I/O pins to interface with a wide range of peripherals, buses, and external devices.
  • Power and Supply  Core voltage range of 1.14 V to 1.26 V for the device core supply requirements.
  • Package and Mounting  668-FCBGA package (27×27 mm) in a surface-mount form factor for compact, high-density board designs.
  • Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance  RoHS-compliant construction to meet common environmental requirements.

Unique Advantages

  • Substantial on-chip logic: 23,040 logic elements provide room for sizeable custom logic blocks and system-level integration without immediate reliance on external logic devices.
  • Integrated embedded RAM: Approximately 2.36 Mbits of on-chip memory reduce external memory requirements for intermediate buffering and local storage.
  • High I/O count: 320 I/Os enable broad connectivity options for parallel interfaces, multi-channel designs, and mixed I/O subsystems.
  • Compact high-density package: The 668-FCBGA (27×27) package supports compact PCB layouts while delivering significant I/O and logic resources.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in standard commercial environments.
  • Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC4VSX25-11FF668C?

The XC4VSX25-11FF668C delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact FCBGA package suitable for commercial-grade programmable designs. Its specification set supports integration of significant custom logic and on-chip buffering while maintaining a low-profile surface-mount footprint.

This device is appropriate for engineering teams and procurement focused on scalable FPGA-based implementations that require measurable on-chip resources, broad interfacing capability, and standard commercial operating conditions.

Request a quote or submit an inquiry to get pricing and availability details for the XC4VSX25-11FF668C.

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