XC4VSX35-10FF668I

The XC4VSX35-10FF668I is a Virtex®-4 SX field programmable gate array in a 668-ball FCBGA package. It provides a high density of programmable logic, embedded memory, and I/O for designs that require substantial on-chip resources and connectivity.

With 34,560 logic elements, approximately 3.54 Mbits of embedded memory, and 448 user I/O pins, this industrial-grade device is designed to integrate complex digital functions while operating across a broad industrial temperature range.

Key Features

• Core Logic  34,560 logic elements provide widespread programmable fabric for implementing complex digital functions and custom processing blocks.
• Embedded Memory  Approximately 3.54 Mbits of on-chip RAM to support buffering, state machines, and local data storage without immediate dependence on external memory.
• I/O Density  448 user I/O pins enable dense peripheral interfacing, wide parallel buses, and multiple high-pin-count interfaces.
• Package  668-ball FCBGA package (27 × 27 mm supplier device footprint) for a compact, board-level implementation with high pin count.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match required device power domains.
• Temperature & Mounting  Industrial operating temperature range of −40 °C to 100 °C and surface-mount packaging suitable for standard SMT assembly.
• Compliance  RoHS-compliant construction supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• Complex digital processing  Implement custom datapaths, protocol engines, and signal processing blocks using the device's large logic and memory resources.
• High-density I/O bridging  Leverage 448 I/Os for interfacing multiple peripherals, parallel buses, or mezzanine connectors in dense system designs.
• Industrial control and automation  Industrial-grade temperature rating and robust package support deployment in factory-floor and process-control environments.

Unique Advantages

• High on-chip integration:  Large logic capacity and embedded RAM reduce reliance on external components, simplifying BOM and board routing.
• Extensive external connectivity:  448 I/Os accommodate complex interfacing requirements without additional multiplexing hardware.
• Compact, high-pin package:  668-FCBGA (27×27 mm) balances pin count and board space for high-density designs.
• Industrial readiness:  −40 °C to 100 °C operating range and surface-mount form factor support industrial deployments.
• Regulatory friendliness:  RoHS compliance eases integration into lead-free manufacturing workflows.
• Defined power domain:  Specified core voltage range (1.14 V–1.26 V) clarifies power-supply requirements for system design.

Why Choose XC4VSX35-10FF668I?

The XC4VSX35-10FF668I positions itself as a high-density FPGA solution that combines substantial programmable logic, multi-megabit embedded memory, and a very high I/O count in a compact industrial-grade FCBGA package. These characteristics make it well suited to engineers building systems that require significant on-chip resources alongside broad external connectivity.

For designs that prioritize integration, predictable power domain requirements, and operation across industrial temperature extremes, this device delivers a clear balance of logic capacity, memory, and I/O. It supports scalable development choices where reducing external components and consolidating functionality on-chip are priorities.

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