XC4VSX35-11FF668C

The XC4VSX35-11FF668C is a Virtex®-4 SX Field Programmable Gate Array (FPGA) from AMD provided in a 668-FCBGA package. This commercial-grade programmable logic device delivers a combination of high logic density, embedded memory, and a large I/O count for complex digital designs.

With 34,560 logic elements, approximately 3.5 Mbits of embedded memory, and 448 I/O pins in a 668-FCBGA (27×27) package, the device is suited for commercial applications that require substantial on-chip logic, memory buffering, and high-density interfacing while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  34,560 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM enable local data buffering and fast access for memory-intensive functions.
• I/O Density & Packaging  448 user I/O pins in a 668-FCBGA (27×27) package support high-pin-count interfaces while maintaining a surface-mount footprint.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, allowing integration into designs with tightly controlled supply rails.
• Operating Range  Rated for commercial operation from 0 °C to 85 °C to meet typical commercial-environment deployment requirements.
• Surface-Mount Package  668-ball FCBGA package with a 27×27 mm footprint for automated PCB assembly and compact system integration.
• Regulatory  RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density I/O Systems  Use the 448 user I/O pins to implement multi-channel interfaces, protocol bridging, or large peripheral connectivity within commercial systems.
• On-chip Memory Buffering  Approximately 3.5 Mbits of embedded RAM provide local buffering and temporary storage for data paths and streaming applications.
• Complex Digital Processing  34,560 logic elements enable implementation of sizable custom logic blocks, datapaths, and control logic for advanced digital designs.
• Compact Board-level Integration  The 668-FCBGA (27×27) surface-mount package supports high-density board layouts where space and pin count are primary constraints.

Unique Advantages

• High Logic Density: 34,560 logic elements reduce the need for multiple devices when implementing large custom logic functions.
• Substantial Embedded Memory: Approximately 3.5 Mbits of on-chip RAM cut reliance on external memory for many buffering and temporary storage tasks.
• Large I/O Count: 448 I/O pins simplify the design of systems requiring many parallel interfaces or numerous peripheral connections.
• Compact FCBGA Package: The 668-FCBGA (27×27) offers a high pin-count in a compact, surface-mount form factor ideal for dense board designs.
• Commercial-grade Operating Range: Rated for 0 °C to 85 °C, suitable for standard commercial electronics and production environments.
• RoHS Compliant: Supports lead-free manufacturing practices and environmental compliance requirements.

Why Choose XC4VSX35-11FF668C?

The XC4VSX35-11FF668C balances significant logic and memory resources with a high I/O count in a compact 668-FCBGA package, making it a practical choice for commercial-grade designs that demand on-chip capacity and dense interfacing. Its specified supply voltage range and operating temperature align it with typical commercial electronics platforms.

This FPGA is appropriate for teams and designs that need sizeable programmable logic, embedded RAM, and extensive connectivity while maintaining a compact board footprint. The combination of these documented characteristics supports scalable implementations and integration into established design flows.

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