XC4VSX35-11FFG668I

The XC4VSX35-11FFG668I is a Virtex-4 SX series FPGA in a 668-ball FCBGA package designed for industrial-grade embedded logic applications. It combines a high count of logic resources and on-chip memory with a broad IO count and controlled supply and temperature ranges to support complex, board-level digital designs.

This device targets applications requiring significant programmable logic capacity and on-chip memory while operating in industrial environments, offering integration that helps simplify system designs.

Key Features

• Logic Capacity — 34,560 logic elements providing substantial programmable logic resource for complex designs.
• Configurable Logic Blocks (CLBs) — 3,840 CLBs for structured logic implementation and partitioning.
• Embedded Memory — Approximately 3.54 Mbits of embedded memory to support buffers, FIFOs, and state storage.
• IO Count — 448 user IOs to interface with broad peripheral and bus requirements.
• Package — 668-FCBGA (27 × 27 mm) package (668-BBGA, FCBGA) suitable for surface-mount PCB assembly.
• Power — Supported core voltage range from 1.14 V to 1.26 V for defined power planning and supply design.
• Temperature Grade — Industrial operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• RoHS Compliance — Lead-free, RoHS-compliant component for environmentally conscious designs.

Typical Applications

• Communications Equipment — Implement protocol processing, packet buffering, and custom interface logic using the device’s large logic and memory resources.
• Industrial Control — Drive motor-control logic, sensor aggregation, and real-time control functions within the industrial temperature range.
• Data Acquisition and Processing — Aggregate and preprocess data streams with on-chip memory and extensive IO connectivity.
• Custom Embedded Systems — Implement application-specific accelerators or glue logic where high programmable logic density and numerous IOs are required.

Unique Advantages

• Substantial Logic Resources: 34,560 logic elements enable large-scale, fully custom digital implementations without external programmable logic.
• Integrated On-Chip Memory: Approximately 3.54 Mbits of embedded RAM reduces reliance on external memory for many buffering and stateful tasks.
• High IO Count: 448 IOs simplify board routing and reduce the need for external IO expanders when connecting multiple peripherals or buses.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to maintain operation across a wide range of field conditions.
• Standard FCBGA Package: 668-ball FCBGA (27 × 27 mm) offers a compact, surface-mount form factor compatible with common PCB assembly processes.
• Predictable Power Envelope: Defined core voltage range (1.14 V–1.26 V) aids supply selection and thermal planning.

Why Choose XC4VSX35-11FFG668I?

The XC4VSX35-11FFG668I positions itself as an industrial-grade, high-capacity FPGA offering a balance of logic density, embedded memory, and extensive IO in a compact FCBGA footprint. Its measured specifications make it appropriate for designers who need scalable programmable logic resources while maintaining clear power and thermal parameters.

This device is well suited to engineering teams building communications, industrial control, and custom embedded systems that require reliable operation across a broad temperature range and reduced dependence on external memory and IO expansion.

Request a quote or submit your requirements to receive pricing and availability information for the XC4VSX35-11FFG668I. Our team can assist with lead time and volume pricing to support your project schedule.