XC4VSX55-10FF1148I
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA |
|---|---|
| Quantity | 222 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 640 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 55296 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5898240 |
Overview of XC4VSX55-10FF1148I – Virtex®-4 SX Field Programmable Gate Array, 1148-BBGA FCBGA
The XC4VSX55-10FF1148I is a Virtex®-4 SX field programmable gate array (FPGA) from AMD. It delivers a high count of programmable logic and embedded memory with a substantial number of I/O pins in a 1148-ball FCBGA package for surface-mount assembly.
This device is specified for industrial-grade operation with a core supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, targeting designs that require high logic density, on-chip memory, and broad I/O connectivity.
Key Features
- Logic Capacity 55,296 logic elements to implement complex digital functions and custom processing pipelines.
- Embedded Memory Approximately 5.9 Mbits of on-chip RAM for data buffering, frame storage, and local lookup tables.
- I/O Density 640 I/O pins provide wide connectivity for parallel interfaces, buses, and external peripherals.
- Package and Mounting 1148-BBGA, FCBGA package (supplier device package: 1148-FCPBGA, 35×35) designed for surface-mount assembly.
- Power Core supply voltage specified from 1.14 V to 1.26 V to match system power rails and power-management designs.
- Industrial Temperature Range Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
- Compliance RoHS compliant to support lead-free manufacturing and regulatory requirements.
Typical Applications
- Industrial control and automation — Leverages industrial temperature rating and high logic density for control logic, I/O aggregation, and protocol bridging in factory systems.
- High-density I/O systems — 640 I/O pins enable broad sensor, actuator, and peripheral interfacing for data acquisition and real-time control.
- Memory-intensive processing — Approximately 5.9 Mbits of embedded RAM supports buffering and local data storage for streaming and signal-processing tasks.
Unique Advantages
- Substantial programmable logic: 55,296 logic elements provide the capacity to integrate multiple custom functions and IP blocks on a single device, reducing board-level component count.
- Large on-chip memory: Approximately 5.9 Mbits of embedded RAM minimizes external memory requirements for many applications, simplifying board design.
- High I/O count: 640 I/Os support complex interfacing needs without additional multiplexers or expanders.
- Industrial suitability: Rated -40 °C to 100 °C and RoHS compliant, enabling deployment in industrial environments with lead-free manufacturing workflows.
- Compact surface-mount package: 1148-ball FCBGA (35×35) package enables high-density board layouts while maintaining connectivity and thermal considerations for embedded systems.
Why Choose XC4VSX55-10FF1148I?
The XC4VSX55-10FF1148I positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive programmable logic, significant embedded memory, and a large complement of I/Os in a compact FCBGA package. With defined operating voltage and temperature ranges and RoHS compliance, it supports robust, manufacturable designs for industrial and high-density interface applications.
Choose this device when your project demands on-chip integration to reduce BOM, support for tight I/O requirements, and the thermal and electrical characteristics needed for industrial deployments.
Request a quote or submit a purchase inquiry to get pricing and availability for the XC4VSX55-10FF1148I.

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