XC4VSX55-10FF1148C

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA

Quantity 1,868 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells55296
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5898240

Overview of XC4VSX55-10FF1148C – Virtex®-4 SX Field Programmable Gate Array (FPGA), 1148-BBGA FCBGA

The XC4VSX55-10FF1148C is a Virtex-4 SX Field Programmable Gate Array (FPGA) from AMD, built for high-density, configurable logic applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex, custom digital designs that require flexible hardware acceleration and extensive interfacing.

With 6,144 CLBs and 55,296 logic elements, approximately 5.9 Mbits of embedded memory, and 640 I/O pins in a 1148-BBGA package, this commercial-grade FPGA targets designs that demand high integration and configurable system-level functionality within a 0 °C to 85 °C operating range.

Key Features

  • Core Logic  6,144 configurable logic blocks (CLBs) delivering 55,296 logic elements for implementing complex programmable logic and custom datapaths.
  • Embedded Memory  Approximately 5.9 Mbits of on-chip RAM to support large buffers, FIFOs, and distributed memory needs without external RAM.
  • High I/O Density  640 user I/O pins to accommodate extensive sensor, peripheral, and bus interfacing in a single device.
  • Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power design and voltage planning for the FPGA core.
  • Package  1148-BBGA (FCBGA) package, supplier package 1148-FCPBGA (35×35), suitable for surface-mount assembly in compact boards.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
  • Regulatory  RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

  • High-density I/O systems  Use the 640 I/O pins to consolidate multiple parallel interfaces, front-end connectors, or extensive sensor arrays into a single programmable device.
  • Embedded memory-centric designs  Leverage approximately 5.9 Mbits of on-chip RAM for buffering, packet handling, or intermediate storage in dataflow and signal-processing pipelines.
  • Custom logic and hardware acceleration  Implement application-specific accelerators and proprietary state machines using the 55,296 logic elements to offload compute from software.

Unique Advantages

  • High logic capacity: The combination of 6,144 CLBs and 55,296 logic elements supports complex, large-scale designs within a single FPGA, reducing board-level component count.
  • Substantial on-chip memory: Approximately 5.9 Mbits of embedded RAM minimizes dependency on external memory for many buffering and streaming tasks, simplifying board design.
  • Extensive I/O connectivity: 640 I/O pins enable broad interfacing options for multi-channel systems and dense peripheral integration.
  • Compact, surface-mount package: The 1148-BBGA (35×35) FCBGA package delivers high pin density in a form factor optimized for modern PCB assembly.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for standard commercial embedded products and systems.

Why Choose XC4VSX55-10FF1148C?

The XC4VSX55-10FF1148C positions itself as a high-capacity, commercially graded FPGA that balances logic density, embedded memory, and a very high I/O count in a single 1148-BBGA package. It is well suited for engineers and designers who need to implement complex, configurable hardware functions while keeping system integration and component count streamlined.

This device offers scalable resources for mid- to high-complexity digital designs and provides long-term value through on-chip memory and connectivity that reduce external BOM and layout complexity. It is an appropriate choice for teams focused on customizable hardware acceleration, dense interfacing, and consolidated system designs within commercial temperature ranges.

Request a quote or submit an inquiry to purchase the XC4VSX55-10FF1148C and get pricing, availability, and lead-time details from our sales team.

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