XC4VSX55-10FF1148C
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 640 5898240 55296 1148-BBGA, FCBGA |
|---|---|
| Quantity | 1,868 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 640 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 55296 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5898240 |
Overview of XC4VSX55-10FF1148C – Virtex®-4 SX Field Programmable Gate Array (FPGA), 1148-BBGA FCBGA
The XC4VSX55-10FF1148C is a Virtex-4 SX Field Programmable Gate Array (FPGA) from AMD, built for high-density, configurable logic applications. It combines a large logic fabric with substantial on-chip memory and a high I/O count to support complex, custom digital designs that require flexible hardware acceleration and extensive interfacing.
With 6,144 CLBs and 55,296 logic elements, approximately 5.9 Mbits of embedded memory, and 640 I/O pins in a 1148-BBGA package, this commercial-grade FPGA targets designs that demand high integration and configurable system-level functionality within a 0 °C to 85 °C operating range.
Key Features
- Core Logic 6,144 configurable logic blocks (CLBs) delivering 55,296 logic elements for implementing complex programmable logic and custom datapaths.
- Embedded Memory Approximately 5.9 Mbits of on-chip RAM to support large buffers, FIFOs, and distributed memory needs without external RAM.
- High I/O Density 640 user I/O pins to accommodate extensive sensor, peripheral, and bus interfacing in a single device.
- Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power design and voltage planning for the FPGA core.
- Package 1148-BBGA (FCBGA) package, supplier package 1148-FCPBGA (35×35), suitable for surface-mount assembly in compact boards.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial applications.
- Regulatory RoHS compliant for reduced hazardous substances in manufacturing.
Typical Applications
- High-density I/O systems Use the 640 I/O pins to consolidate multiple parallel interfaces, front-end connectors, or extensive sensor arrays into a single programmable device.
- Embedded memory-centric designs Leverage approximately 5.9 Mbits of on-chip RAM for buffering, packet handling, or intermediate storage in dataflow and signal-processing pipelines.
- Custom logic and hardware acceleration Implement application-specific accelerators and proprietary state machines using the 55,296 logic elements to offload compute from software.
Unique Advantages
- High logic capacity: The combination of 6,144 CLBs and 55,296 logic elements supports complex, large-scale designs within a single FPGA, reducing board-level component count.
- Substantial on-chip memory: Approximately 5.9 Mbits of embedded RAM minimizes dependency on external memory for many buffering and streaming tasks, simplifying board design.
- Extensive I/O connectivity: 640 I/O pins enable broad interfacing options for multi-channel systems and dense peripheral integration.
- Compact, surface-mount package: The 1148-BBGA (35×35) FCBGA package delivers high pin density in a form factor optimized for modern PCB assembly.
- Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for standard commercial embedded products and systems.
Why Choose XC4VSX55-10FF1148C?
The XC4VSX55-10FF1148C positions itself as a high-capacity, commercially graded FPGA that balances logic density, embedded memory, and a very high I/O count in a single 1148-BBGA package. It is well suited for engineers and designers who need to implement complex, configurable hardware functions while keeping system integration and component count streamlined.
This device offers scalable resources for mid- to high-complexity digital designs and provides long-term value through on-chip memory and connectivity that reduce external BOM and layout complexity. It is an appropriate choice for teams focused on customizable hardware acceleration, dense interfacing, and consolidated system designs within commercial temperature ranges.
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