XC4VSX35-11FF668I
| Part Description |
Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 448 3538944 34560 668-BBGA, FCBGA |
|---|---|
| Quantity | 1,172 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 668-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 668-BBGA, FCBGA | Number of I/O | 448 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 3840 | Number of Logic Elements/Cells | 34560 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3538944 |
Overview of XC4VSX35-11FF668I – Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 448 3538944 34560 668-BBGA, FCBGA
The XC4VSX35-11FF668I is a Virtex®-4 SX series FPGA from AMD provided in a 668-FCBGA (27×27) surface-mount package. It integrates a substantial logic fabric, on-chip memory and a high I/O count for designs that require flexible, reprogrammable digital logic with industrial-grade temperature capability.
With 34,560 logic elements, approximately 3.54 Mbits of embedded memory and 448 I/O, this device is oriented toward applications that need significant logic capacity, local RAM and broad external interfacing within a compact BGA package.
Key Features
- Logic Capacity 34,560 logic elements organized across 3,840 logic blocks, enabling complex combinational and sequential implementations without external logic.
- Embedded Memory Approximately 3.54 Mbits of on-chip RAM for buffering, on-chip data storage and low-latency processing.
- I/O Density 448 dedicated I/O pins to support wide parallel buses, multiple serial interfaces or mixed-signal front ends via external transceivers.
- Power Supply Range Operates from 1.14 V to 1.26 V, suitable for systems designed around the specified core voltage range.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C and marked as Industrial grade for deployment in temperature-demanding environments.
- Package and Mounting 668-FCBGA (27×27) surface-mount package provides a compact footprint with high-pin-count routing capability for dense system boards.
- RoHS Compliant Manufactured in accordance with RoHS requirements.
Typical Applications
- Industrial Control Implements motor control, PLC logic and real-time I/O aggregation leveraging the industrial temperature rating and high I/O count.
- Data Processing On-chip memory and large logic capacity support packet processing, signal aggregation and deterministic data-path functions.
- High-Density I/O Systems Provides the pin count and logic resources needed for board-level aggregation of sensors, converters and parallel interfaces.
Unique Advantages
- Substantial Logic Resources: 34,560 logic elements allow implementation of sizeable custom logic and control state machines on a single device.
- Significant On-Chip RAM: Approximately 3.54 Mbits of embedded memory reduces reliance on external RAM for buffering and local data storage, simplifying board-level design.
- High I/O Count: 448 I/O pins enable direct interfacing to numerous peripherals and wide buses without extra interface chips.
- Industrial Thermal Capability: −40 °C to 100 °C rating supports deployment in temperature-challenging environments common in industrial systems.
- Compact High-Pin Package: 668-FCBGA (27×27) delivers high integration density suitable for space-constrained, high-functionality boards.
- Standards-Compliant Manufacturing: RoHS compliance aligns with environmental and regulatory requirements for lead-free production.
Why Choose XC4VSX35-11FF668I?
The XC4VSX35-11FF668I balances sizable logic capacity, multi-megabit embedded memory and a high I/O count in a compact 668-FCBGA package, making it a practical choice for engineers designing industrial-grade FPGA-based systems. It is suited to projects that require integrated on-chip resources and reliable operation across a wide temperature range.
As an AMD Virtex-4 SX family device, it is provided with manufacturer documentation and design resources to support integration into production designs, offering a scalable path for applications that need reprogrammable logic, local memory and broad external interfacing.
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