XC4VSX25-10FF668C

The XC4VSX25-10FF668C is a Virtex®-4 SX field programmable gate array (FPGA) supplied in a 668-ball FCBGA package (27×27). It provides a combination of programmable logic resources, embedded memory, and a high I/O count in a surface-mount commercial-grade device.

This device is suited to designs that require significant on-chip logic and memory capacity while operating within a 1.14 V to 1.26 V supply range and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 23,040 logic elements to implement custom digital logic and control functions.
• Embedded Memory — Approximately 2.36 Mbits of on-chip RAM for data buffering, lookup tables, and state storage.
• I/O Count — 320 user I/O pins to support multiple external interfaces and parallel connections.
• Package — 668-ball FCBGA (27×27) package suitable for high-density board designs and surface-mount assembly.
• Power — Core supply range from 1.14 V to 1.26 V to match system power rails and regulator choices.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C.
• Mounting — Surface mount device for standard PCB assembly processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom Digital Systems — Implement complex, application-specific logic using the device’s 23,040 logic elements and embedded RAM.
• I/O-Intensive Designs — Support multiple parallel interfaces and external peripherals with 320 user I/O pins.
• Embedded Memory Requirements — Use approximately 2.36 Mbits of on-chip RAM for buffering, tables, and local data storage.

Unique Advantages

• Substantial Logic Resource: 23,040 logic elements enable integration of large or multiple functions on a single device, reducing overall BOM count.
• On-Chip Memory: Approximately 2.36 Mbits of embedded RAM lowers external memory dependencies and improves data throughput for local storage needs.
• High I/O Density: 320 I/Os provide flexibility for interfacing with a variety of peripherals and bus architectures.
• Compact, High-Density Package: 668-ball FCBGA (27×27) helps conserve PCB area while supporting many signals in a single package.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• RoHS Compliant: Meets environmental requirements for lead-free assembly processes.

Why Choose XC4VSX25-10FF668C?

The XC4VSX25-10FF668C balances sizeable programmable logic capacity, substantial embedded memory, and a high I/O count in a single commercial-grade FCBGA package. It is well suited for engineers and designers who need to consolidate multiple digital functions and local memory on one device while maintaining a compact board footprint.

With defined supply and temperature parameters, RoHS compliance, and a high-density 668-ball package, this Virtex®-4 SX FPGA is positioned for applications where on-chip integration and I/O flexibility are priorities. It delivers a scalable hardware platform for teams focused on efficient system integration and long-term design stability.

Request a quote or submit your requirements to receive pricing and availability for the XC4VSX25-10FF668C. Our team will respond with the information needed to move your project forward.