XC4VSX25-10FFG668C

IC FPGA 320 I/O 668FCBGA
Part Description

Virtex®-4 SX Field Programmable Gate Array (FPGA) IC 320 2359296 23040 668-BBGA, FCBGA

Quantity 383 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package668-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case668-BBGA, FCBGANumber of I/O320Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2560Number of Logic Elements/Cells23040
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2359296

Overview of XC4VSX25-10FFG668C – Virtex®-4 SX FPGA, 668-FCBGA

The XC4VSX25-10FFG668C is a Virtex®-4 SX field programmable gate array (FPGA) in a 668-ball FCBGA package. It integrates substantial programmable logic, on-chip embedded memory and a high I/O count to support designs that require dense digital integration.

With 23,040 logic elements, approximately 2.36 Mbits of embedded RAM and 320 I/O pins, this surface-mount FPGA is intended for commercial-temperature applications that require significant logic capacity and on-chip memory within a compact FCBGA footprint.

Key Features

  • Programmable Logic 23,040 logic elements provide a significant resource pool for implementing custom digital functions and system logic.
  • Embedded Memory Approximately 2.36 Mbits of on-chip RAM supports local data storage for buffering, lookup tables and intermediate processing.
  • I/O Capacity 320 user I/O pins enable wide external interfacing and routing to peripherals, buses and daughter cards.
  • Package 668-FCBGA (27 × 27 mm) surface-mount package offers a compact, high-density form factor for board-level integration.
  • Power Operates from a core supply range of 1.14 V to 1.26 V, suitable for designs matching that supply domain.
  • Operating Range and Grade Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental conformity.

Typical Applications

  • Complex digital systems — Implements large-scale custom logic and control functions where high logic element counts are required.
  • Embedded memory-dependent designs — Uses on-chip RAM to reduce external memory needs for buffering and local data processing.
  • High I/O interfacing — Serves as a bridge or controller in systems that require numerous parallel or multiplexed I/O connections.
  • Board-level integration — Fits compact, high-density PCBs where the 668-FCBGA package and surface-mount mounting minimize board area.

Unique Advantages

  • Substantial logic capacity: 23,040 logic elements allow implementation of complex logic and integrated subsystems without frequent external ASIC use.
  • On-chip RAM reduces BOM: Approximately 2.36 Mbits of embedded memory can lower dependence on external memory components.
  • High pin count for connectivity: 320 I/O pins provide flexibility for interfacing to multiple peripherals and buses.
  • Compact FCBGA footprint: 668-ball, 27 × 27 mm package enables high-density board designs while keeping a surface-mount assembly flow.
  • Commercial temperature grade: Rated for 0 °C to 85 °C operation to match a wide range of standard electronic products.
  • RoHS compliant: Conforms to RoHS for environmental compliance in assembly and procurement.

Why Choose XC4VSX25-10FFG668C?

The XC4VSX25-10FFG668C positions itself as a capable mid-to-high density Virtex-4 SX FPGA option for designs that need a balance of logic resources, embedded RAM and extensive I/O in a compact package. Its defined core voltage range and commercial operating window make it suitable for mainstream electronic systems that require reliable programmable logic integration.

Choose this FPGA when your project demands significant on-chip logic and memory capacity combined with a high I/O count and a 668-FCBGA surface-mount package. The device supports designers seeking scalability and reduced external component count while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry for XC4VSX25-10FFG668C to obtain pricing, availability and ordering information for your next design.

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