XC7A12T-2CSG325I

The XC7A12T-2CSG325I is an Artix-7 series FPGA from AMD, delivered in a 324-pin LFBGA/CSPBGA package. It provides a balance of configurable logic, embedded RAM and I/O capability in an industrial-grade device.

With 12,800 logic elements, 150 user I/Os and approximately 0.74 Mbits of on-chip RAM, this device targets embedded and industrial designs that require configurable digital logic, moderate memory resources and robust operating temperature support.

Key Features

• Logic Capacity 12,800 logic elements for implementing custom digital functions and state machines.
• Embedded Memory Approximately 0.74 Mbits (737,280 bits) of on-chip RAM for buffering, FIFOs and small data structures without external memory.
• I/O Resources 150 user I/O pins to interface with sensors, peripherals and external logic.
• Power Core voltage supply range of 0.95 V to 1.05 V to match system power rails and power sequencing requirements.
• Package and Mounting 324-LFBGA, CSPBGA package (supplier device package: 324-CSPBGA, 15×15) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Compliance RoHS-compliant construction.

Typical Applications

• Industrial Control Use the device's 12,800 logic elements and 150 I/Os to implement custom control logic, motor interfaces and sensor aggregation in industrial equipment.
• Embedded Processing On-chip RAM and programmable logic enable glue logic, protocol bridging and pre-processing in embedded systems.
• Communications Interfaces Leverage the I/O count and configurable logic to implement protocol adaptors and data path functions in networking and instrumentation hardware.

Unique Advantages

• Balanced Logic and Memory: 12,800 logic elements paired with approximately 0.74 Mbits of embedded RAM lets you partition functions between logic and fast on-chip memory.
• Generous I/O Count: 150 user I/Os minimize the need for external interface chips and simplify board-level connectivity.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade designation support demanding environmental conditions.
• Compact, Surface-Mount Package: The 324-LFBGA/CSPBGA (15×15) package provides a high-density solution for space-constrained PCBs.
• Low-Voltage Core: Core supply range of 0.95–1.05 V aligns with modern power delivery schemes and helps optimize system power design.
• RoHS Compliant: Meets common environmental compliance expectations for electronic assemblies.

Why Choose XC7A12T-2CSG325I?

The XC7A12T-2CSG325I offers a practical combination of logic resources, embedded memory and I/O in a compact, industrial-grade package from AMD. It is well suited to engineers designing embedded and industrial systems that need configurable logic, reliable operation across a wide temperature range and a dense surface-mount package.

Choosing this Artix-7 device provides a measured balance of integration and flexibility for mid-density FPGA applications, enabling reduction of external components while supporting scalable designs backed by a recognized FPGA manufacturer.

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