XC7A12T-3CSG325E

The XC7A12T-3CSG325E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, provided in a 324-LFBGA/CSPBGA package. It delivers programmable digital logic with integrated on-chip memory and a substantial I/O count for designs that require flexible logic implementation and board-level integration.

Key attributes include approximately 12,800 logic elements, about 0.737 Mbits of embedded memory, and support for up to 150 I/O signals. The device is offered in an extended grade with surface-mount packaging suitable for compact system designs.

Key Features

• Logic Capacity — Approximately 12,800 logic elements for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.737 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O — Up to 150 general-purpose I/O pins to interface with peripherals, sensors, and other system components.
• Power — Core supply range of 950 mV to 1.05 V to match low-voltage system power domains.
• Package & Mounting — 324-LFBGA, CSPBGA package (supplier device package: 324-CSPBGA (15×15)) in a surface-mount form factor for space-efficient PCB layouts.
• Operating Range — Extended grade with specified operating temperature from 0 °C to 100 °C.
• Compliance — RoHS compliant, meeting standard environmental requirements for lead-free assembly.

Typical Applications

• Custom digital logic — Implement application‑specific accelerators, glue logic, and control sequences using the device's logic elements and embedded memory.
• I/O‑dense interfaces — Support designs that require up to 150 I/O signals for parallel interfaces, signal routing, or protocol bridging.
• On-chip buffering and data handling — Use the embedded RAM for temporary data storage, FIFO buffering, or small local memories.

Unique Advantages

• Balanced logic and memory — The combination of ~12,800 logic elements and ~0.737 Mbits of RAM supports a wide range of mid-density designs without external memory.
• Flexible I/O count — 150 available I/O pins enable integration of multiple peripherals and parallel interfaces directly on-chip.
• Compact, surface-mount package — The 324-CSPBGA (15×15) package supports high-density PCB placement and modern assembly processes.
• Low-voltage core support — Core supply range from 950 mV to 1.05 V allows integration into low-voltage system domains.
• Extended operating grade — Rated for 0 °C to 100 °C operation, suitable for many commercial and industrial-adjacent environments.
• Environmental compliance — RoHS compliant for lead-free manufacturing requirements.

Why Choose XC7A12T-3CSG325E?

The XC7A12T-3CSG325E positions itself as a mid-density Artix-7 FPGA option that balances logic capacity, embedded memory, and a substantial I/O count within a compact 324-LFBGA/CSPBGA footprint. Its extended-grade specification and RoHS compliance make it a practical choice for designs that require reliable on-chip resources and modern surface-mount integration.

Choose this device when your design needs around 12,800 logic elements, approximately 0.737 Mbits of on-chip RAM, and up to 150 I/O in a 324-CSPBGA (15×15) package, with a core supply of 950 mV–1.05 V and operational support from 0 °C to 100 °C.

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