XC7A12T-L2CPG236E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 737280 12800 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 396 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 12800 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC7A12T-L2CPG236E – Artix-7 Field Programmable Gate Array (FPGA)
The XC7A12T-L2CPG236E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 238-ball LFBGA / CSBGA package. It combines programmable logic, on-chip memory, and a substantial I/O count in a compact surface-mount form factor.
With 12,800 logic elements and approximately 0.737 Mbits of embedded memory, this device is suitable for designs that require moderate logic density, on-chip RAM and flexible I/O while operating within a 0.95 V to 1.05 V core supply range and an extended temperature grade of 0 °C to 100 °C.
Key Features
- Core Logic Provides 12,800 logic elements for implementing custom digital logic and control functions.
- Embedded Memory Approximately 0.737 Mbits of on-chip RAM (737,280 bits) to support local buffering, state machines and intermediate data storage.
- I/O Resources 106 user I/O pins to support multiple interfaces, peripheral connections and board-level signaling.
- Power Core voltage operation specified between 950 mV and 1.05 V, allowing designers to plan power delivery and sequencing accordingly.
- Package & Mounting Available in a 238-LFBGA / CSPBGA package with supplier device package 238-CSBGA (10×10); surface-mount package for compact board integration.
- Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for general-purpose embedded applications.
- Standards Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.
Typical Applications
- Custom digital logic and prototyping Use the device’s 12,800 logic elements and on-chip RAM for implementing and validating custom state machines, data-paths and control logic.
- Interface bridging and protocol adaptation Leverage 106 I/Os to connect and translate between multiple board-level interfaces and peripherals.
- Embedded control and signal processing On-chip memory and programmable logic support buffering, deterministic control loops and mid-range signal processing tasks.
Unique Advantages
- Balanced logic density: 12,800 logic elements provide capacity for moderate-complexity designs without the footprint of larger FPGAs.
- Integrated on-chip RAM: Approximately 0.737 Mbits of embedded memory reduces external memory dependence for many control and buffering functions.
- Generous I/O count: 106 I/Os enable flexible board-level integration and multiple peripheral connections.
- Compact BGA packaging: 238-ball LFBGA / CSBGA (238-CSBGA 10×10) allows high-density placement on space-constrained PCBs.
- Defined power window: Core supply range of 950 mV to 1.05 V helps simplify power-supply selection and system power budgeting.
- Extended operating range: 0 °C to 100 °C qualification supports deployed systems in a wide range of ambient conditions.
Why Choose XC7A12T-L2CPG236E?
The XC7A12T-L2CPG236E positions itself as a balanced, surface-mount Artix-7 FPGA option where moderate logic capacity, on-chip RAM and a flexible I/O complement are required. Its combination of 12,800 logic elements, approximately 0.737 Mbits of embedded memory and 106 I/Os makes it suitable for embedded control, protocol bridging and mid-range signal processing tasks.
Engineers and procurement teams benefit from a compact 238-ball BGA package, defined core voltage range and RoHS compliance, enabling reliable integration into production PCBs while supporting common environmental and assembly requirements.
Request a quote or submit an inquiry to receive pricing, availability and additional procurement details for the XC7A12T-L2CPG236E.

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