XC7A12T-L2CPG236E

IC FPGA 106 I/O 236BGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 106 737280 12800 238-LFBGA, CSPBGA

Quantity 396 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeExtendedOperating Temperature0°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O106Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells12800
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits737280

Overview of XC7A12T-L2CPG236E – Artix-7 Field Programmable Gate Array (FPGA)

The XC7A12T-L2CPG236E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 238-ball LFBGA / CSBGA package. It combines programmable logic, on-chip memory, and a substantial I/O count in a compact surface-mount form factor.

With 12,800 logic elements and approximately 0.737 Mbits of embedded memory, this device is suitable for designs that require moderate logic density, on-chip RAM and flexible I/O while operating within a 0.95 V to 1.05 V core supply range and an extended temperature grade of 0 °C to 100 °C.

Key Features

  • Core Logic  Provides 12,800 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 0.737 Mbits of on-chip RAM (737,280 bits) to support local buffering, state machines and intermediate data storage.
  • I/O Resources  106 user I/O pins to support multiple interfaces, peripheral connections and board-level signaling.
  • Power  Core voltage operation specified between 950 mV and 1.05 V, allowing designers to plan power delivery and sequencing accordingly.
  • Package & Mounting  Available in a 238-LFBGA / CSPBGA package with supplier device package 238-CSBGA (10×10); surface-mount package for compact board integration.
  • Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for general-purpose embedded applications.
  • Standards Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.

Typical Applications

  • Custom digital logic and prototyping  Use the device’s 12,800 logic elements and on-chip RAM for implementing and validating custom state machines, data-paths and control logic.
  • Interface bridging and protocol adaptation  Leverage 106 I/Os to connect and translate between multiple board-level interfaces and peripherals.
  • Embedded control and signal processing  On-chip memory and programmable logic support buffering, deterministic control loops and mid-range signal processing tasks.

Unique Advantages

  • Balanced logic density: 12,800 logic elements provide capacity for moderate-complexity designs without the footprint of larger FPGAs.
  • Integrated on-chip RAM: Approximately 0.737 Mbits of embedded memory reduces external memory dependence for many control and buffering functions.
  • Generous I/O count: 106 I/Os enable flexible board-level integration and multiple peripheral connections.
  • Compact BGA packaging: 238-ball LFBGA / CSBGA (238-CSBGA 10×10) allows high-density placement on space-constrained PCBs.
  • Defined power window: Core supply range of 950 mV to 1.05 V helps simplify power-supply selection and system power budgeting.
  • Extended operating range: 0 °C to 100 °C qualification supports deployed systems in a wide range of ambient conditions.

Why Choose XC7A12T-L2CPG236E?

The XC7A12T-L2CPG236E positions itself as a balanced, surface-mount Artix-7 FPGA option where moderate logic capacity, on-chip RAM and a flexible I/O complement are required. Its combination of 12,800 logic elements, approximately 0.737 Mbits of embedded memory and 106 I/Os makes it suitable for embedded control, protocol bridging and mid-range signal processing tasks.

Engineers and procurement teams benefit from a compact 238-ball BGA package, defined core voltage range and RoHS compliance, enabling reliable integration into production PCBs while supporting common environmental and assembly requirements.

Request a quote or submit an inquiry to receive pricing, availability and additional procurement details for the XC7A12T-L2CPG236E.

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