XC7A12T-L1CPG238I

The XC7A12T-L1CPG238I is an Artix-7 field programmable gate array (FPGA) in a 238‑LFBGA surface-mount package designed for industrial applications. It combines 12,800 logic elements with approximately 0.74 Mbits of embedded memory and 106 general-purpose I/O to support mid-density programmable logic and system integration.

Key value comes from a compact 238‑CSBGA (10×10) package, industrial-grade operating range, and a low core supply window, enabling integration into space- and power-constrained designs that require robustness across −40°C to 100°C.

Key Features

• Core / Logic — 12,800 logic elements for implementing custom digital logic, state machines, and glue logic.
• Embedded Memory — Approximately 0.74 Mbits of on-chip RAM (737,280 bits) to store intermediate data, buffering, and small lookup tables without external memory.
• I/O — 106 user I/O pins to interface with peripherals, sensors, buses, and other system components.
• Power — Core supply range from 950 mV to 1.05 V to support low-voltage FPGA core operation.
• Package & Mounting — 238‑LFBGA / 238‑CSBGA (10×10) surface-mount package for compact board-level integration.
• Temperature Range — Industrial operating temperature from −40°C to 100°C for deployments in demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, sensor interfacing, and deterministic I/O handling within industrial automation systems using the industrial temperature rating.
• Embedded System Integration — Integrate glue logic, protocol bridging, and custom peripherals where modest on-chip memory and medium logic density are required.
• Signal and Data Conditioning — Perform mid-rate data buffering and preprocessing using embedded RAM and available I/O resources.
• Prototyping and Development — Validate and iterate custom digital designs in a compact BGA package with accessible I/O count and logic capacity.

Unique Advantages

• Balanced logic density: 12,800 logic elements provide a mid-range resource pool suitable for many custom logic and integration tasks without excess overhead.
• On‑chip memory: Approximately 0.74 Mbits of embedded RAM reduces dependency on external memory for small buffers and lookup tables, simplifying BOM and board layout.
• Wide operating temperature: −40°C to 100°C rating supports deployments in industrial and otherwise challenging thermal environments.
• Compact package: 238‑CSBGA (10×10) LFBGA footprint enables dense board layouts and space-constrained designs.
• Low-voltage core: Core operation between 0.95 V and 1.05 V helps meet low-power supply domains and system power budgets.
• RoHS compliant: Meets common environmental requirements for lead-free assembly and regulatory alignment.

Why Choose XC7A12T-L1CPG238I?

The XC7A12T-L1CPG238I positions itself as a compact, industrial-grade FPGA option that balances logic capacity, embedded memory, and I/O in a small BGA package. Its combination of 12,800 logic elements, roughly 0.74 Mbits of on-chip RAM, and 106 I/Os makes it suitable for designers who need mid-density programmable logic with robust thermal performance.

This part is well suited for teams building industrial control, embedded integration, and signal-conditioning functions that benefit from on-chip resources and a reduced external component count. The industrial temperature rating and RoHS compliance support long-term deployment and regulatory needs.

Request a quote or submit a sales inquiry to obtain pricing and availability for the XC7A12T-L1CPG238I. Our team can assist with lead times and procurement details to help move your design forward.