XC7A12T-3CPG236E
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 737280 12800 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,447 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 12800 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 737280 |
Overview of XC7A12T-3CPG236E – Artix-7 Field Programmable Gate Array (FPGA) IC, 238-LFBGA
The XC7A12T-3CPG236E is an Artix-7 field programmable gate array (FPGA) offering a balance of programmable logic, embedded memory, and I/O capability in a 238-pin LFBGA/CSPBGA package. It provides 12,800 logic elements and approximately 0.74 Mbits of on-chip RAM to support a wide range of programmable digital designs.
Designed for surface-mount assembly with a 238-CSBGA (10×10) supplier package, this device operates from a core voltage range of 950 mV to 1.05 V and is rated for an extended grade operating temperature of 0 °C to 100 °C.
Key Features
- Programmable Logic 12,800 logic elements provide the core programmable fabric for implementing custom digital functions and parallel processing pipelines.
- On‑chip Memory Approximately 0.74 Mbits of embedded RAM (737,280 total bits) for data buffering, FIFOs, and small lookup tables.
- I/O Capacity 106 user I/O pins to interface with external peripherals, sensors, and buses.
- Power and Voltage Core supply range of 950 mV to 1.05 V to match system power domains and enable regulated low‑voltage operation.
- Package and Mounting 238-LFBGA / CSPBGA package with supplier device package 238-CSBGA (10×10); surface-mount mounting type for compact board designs.
- Operating Range and Grade Extended grade device rated for operation from 0 °C to 100 °C.
- RoHS Compliant Environmentally compliant with RoHS regulations.
Typical Applications
- Custom digital logic Implement application-specific processing and control logic using the device’s 12,800 logic elements.
- Interface and bridging Use the 106 I/O pins to implement protocol bridging, I/O concentration, and signal conditioning between subsystems.
- Data buffering and small-memory functions Employ approximately 0.74 Mbits of embedded RAM for FIFOs, small frame buffers, and caching.
- Low-voltage FPGA designs Integrate into systems with a core supply between 950 mV and 1.05 V to align with modern low-voltage power architectures.
Unique Advantages
- Balanced logic and memory: 12,800 logic elements paired with substantial on-chip RAM supports moderately complex programmable designs without excessive external memory.
- Compact package options: 238-LFBGA / CSPBGA packaging and a 10×10 supplier package enable dense PCB layouts while maintaining robust I/O connectivity.
- Low-voltage core operation: Narrow voltage supply window (950 mV–1.05 V) simplifies power-rail design and helps maintain consistent core performance.
- Extended operating grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and extended-temperature system requirements.
- RoHS compliance: Environmentally compliant manufacturing status eases integration into RoHS-governed product lines.
Why Choose XC7A12T-3CPG236E?
The XC7A12T-3CPG236E positions itself as a versatile Artix-7 FPGA option for designers needing a mid-range mix of programmable logic, embedded memory, and I/O in a compact BGA package. Its 12,800 logic elements and approximately 0.74 Mbits of RAM support custom digital functions and moderate data buffering while the 106 I/O pins provide flexible system interfacing.
This device is suitable for development efforts and production designs that require low-voltage core operation, surface-mount packaging, and extended-grade temperature support. The combination of package density, I/O count, and RoHS compliance offers long-term design stability and supply-chain compatibility.
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