XCV400-5BG432C

The XCV400-5BG432C is a Virtex® SRAM-based Field Programmable Gate Array supplied by AMD. It combines high-density programmable logic with embedded memory and extensive I/O to address medium- to high-complexity system designs.

Targeted at commercial applications, the device provides in-system reprogrammability and a flexible architecture for tasks such as interface bridging, PCI/Compact PCI I/O, and designs that require significant on-chip logic and memory integration.

Key Features

• Core Logic  10,800 logic elements (reported as logic cells) and approximately 468,252 system gates provide substantial programmable logic capacity for complex functions.
• Embedded Memory  Approximately 0.082 Mbits (81,920 bits) of on-chip RAM and hierarchical memory architecture with LUT-configurable RAM and dedicated block RAM options.
• I/O and Interfaces  316 general-purpose I/O pins and multi-standard SelectIO support, enabling connectivity across a variety of signaling standards. Datasheet references include direct connectivity to ZBTRAM devices.
• Clocking and Timing  Four dedicated delay-locked loops (DLLs), four primary low-skew global clock nets and multiple local clock nets support advanced clock management and system timing.
• Configuration and Reprogrammability  SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (SelectMAP™, slave serial, master serial, JTAG) for flexible deployment and field updates.
• Package and Mechanical  432-LBGA exposed pad metal package (supplier package 432-MBGA, 40×40) in a surface-mount form factor suited to compact board designs.
• Power and Thermal  Voltage supply range of 2.375 V to 2.625 V and commercial operating temperature range of 0 °C to 85 °C.
• Standards and Test  Documented compliance with PCI signaling at 66 MHz and 100% factory tested silicon; RoHS compliant.

Typical Applications

• PCI and Compact PCI systems  Supports 66‑MHz PCI signaling and is specified as hot‑swappable for Compact PCI in datasheet content, making it suitable for PCI-based host and peripheral designs.
• Memory interface and bridging  Direct connectivity to ZBTRAM devices and fast interfaces to external high-performance RAMs enable design of memory controllers and interface bridges.
• In-field reconfigurable systems  SRAM-based architecture with multiple configuration modes supports in-system reprogramming and iterative development workflows.
• Medium-to-high density logic integration  Use where substantial on-chip logic and embedded RAM are needed for custom processing, protocol handling, or glue logic between subsystems.

Unique Advantages

• Significant programmable capacity: 10,800 logic elements and ~468k system gates allow consolidation of multiple functions into a single device, reducing board-level component count.
• Flexible memory options: On-chip RAM plus LUT-configurable memory and block RAM support a range of storage and buffering strategies without immediate reliance on external RAM.
• Advanced clock management: Integrated DLLs and multiple clock distribution nets simplify timing control for multi-clock systems and high-performance data paths.
• Field-upgradable architecture: SRAM-based configuration with unlimited re-programmability enables rapid design iterations and in-field updates.
• Compact, manufacturable package: 432-LBGA exposed pad metal package in a surface-mount form factor supports dense board layouts and thermal management through the exposed pad.
• Commercial-grade qualification: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose XCV400-5BG432C?

The XCV400-5BG432C delivers a balanced combination of programmable fabric, embedded memory, and robust I/O in a compact 432-LBGA package. Its SRAM-based architecture and multiple configuration modes support rapid development cycles and in-field updates, while integrated clock-management features and SelectIO interfaces enable designs requiring precise timing and diverse I/O standards.

This device is well suited for engineering teams building commercial systems that need medium-to-high logic capacity, versatile memory options, and PCI/Compact PCI compatibility, backed by documented design support and factory testing.

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