XCV400-5FG676C

IC FPGA 404 I/O 676FCBGA
Part Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 81920 10800 676-BGA

Quantity 569 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O404Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates468252ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of XCV400-5FG676C – Virtex® FPGA – 676‑BGA, 10,800 logic elements, 404 I/O

The XCV400-5FG676C is an SRAM-based Virtex® Field Programmable Gate Array (FPGA) offered in a 676-ball BGA package. It delivers a high-density, reprogrammable logic fabric with 10,800 logic elements and 2,400 configurable logic blocks (CLBs) arranged for complex digital designs.

Designed for systems that require abundant I/O, embedded memory, and advanced clock management, this device is suited to applications needing flexible in-system configuration, multi-standard I/O interfaces, and a hierarchical memory architecture.

Key Features

  • Core Logic — 10,800 logic elements implemented across a 2,400 CLB array, enabling high-density programmable logic and complex combinational/sequential functions.
  • On-chip Memory — Approximately 81,920 bits of embedded RAM plus support for configurable LUT-based RAM and 4k-bit dual-ported RAM blocks for flexible storage and buffering.
  • I/O Capacity — 404 available I/O pins to support wide parallel interfaces and multiple external connections.
  • Clock Management — Built-in clock-management circuitry including four dedicated delay-locked loops (DLLs) and multiple global/local clock nets for low-skew clock distribution.
  • Dedicated Arithmetic Support — Dedicated carry logic and multiplier support to accelerate arithmetic and DSP-like functions.
  • Configuration & Re-programmability — SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes.
  • Process & Quality — Fabricated on a 0.22 μm, 5-layer-metal CMOS process and 100% factory tested.
  • Package & Power — 676‑BGA (27 × 27 mm) package; specified supply voltage range 2.375 V to 2.625 V.
  • Operating Range — Commercial grade operation from 0 °C to 85 °C.
  • Design Integration — Hierarchical routing and internal 3-state bussing with IEEE 1149.1 boundary-scan logic for board-level testability.

Typical Applications

  • PCI and Compact PCI systems — Suitable for designs requiring 66-MHz PCI compliance and hot‑swappable Compact PCI implementations as noted in the device family documentation.
  • High-density digital processing — Implements complex logic functions and arithmetic engines using dedicated carry and multiplier resources.
  • Memory-intensive interfaces — Ideal for designs that connect to external high-performance RAMs or ZBTRAM devices and that leverage the device’s embedded RAM and configurable LUT memory.
  • In-system configurable logic — Reprogrammable FPGA fabrics for prototyping, iterative development, and field updates via multiple configuration modes.

Unique Advantages

  • High integration density: 10,800 logic elements provide substantial logic capacity in a single 676‑BGA package, reducing board-level component count.
  • Extensive I/O support: 404 I/O pins allow direct interfacing with broad parallel buses and multiple peripheral devices.
  • Flexible memory architecture: Approximately 81,920 bits of on-chip RAM plus configurable LUT-based RAM options enable varied storage configurations without adding external memory.
  • Robust clock control: Four DLLs and multiple global/local clock nets enable precise timing control for multi-clock-domain designs.
  • Re-programmable in-system: SRAM-based configuration supports unlimited re-programmability and multiple programming modes for design iteration and field updates.
  • Manufacturing quality: Fabricated in a 0.22 μm, 5-layer-metal process and 100% factory tested for predictable production reliability.

Why Choose XCV400-5FG676C?

The XCV400-5FG676C combines a high-density FPGA fabric with extensive I/O, embedded memory, and advanced clock-management features to address complex digital designs that require in-system flexibility and reliable production testing. Its commercial-grade temperature range and defined supply voltage make it straightforward to integrate into a wide range of system boards.

This device is well suited for engineering teams needing a reprogrammable, high-capacity logic solution with strong support for memory interfaces, deterministic clocking, and a proven manufacturing process. The combination of logic capacity, on-chip memory, and configuration flexibility provides a scalable platform for iterative development and deployment.

Request a quote or submit a product inquiry to receive pricing, availability, and technical support for the XCV400-5FG676C. Our team can provide the information needed to evaluate this FPGA for your next design.

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