XCV400-6BG432C

The XCV400-6BG432C is a Virtex® family SRAM-based FPGA offering a high-capacity, reprogrammable logic platform in a 432-LBGA exposed pad package. It provides a balance of density and system performance for commercial-grade designs, with architecture features aimed at complex digital logic, high-speed interfaces, and on-chip memory flexibility.

Key electrical and environmental parameters include a nominal supply range of 2.375 V to 2.625 V and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and 100% factory tested.

Key Features

• Logic Capacity — Approximately 10,800 logic elements and a total of 468,252 system gates provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 0.082 Mbits of on-chip RAM (81,920 bits) and configurable LUT-based RAM options support hierarchical memory architectures and fast internal buffering.
• I/O Density — 316 user I/O pins enable high-density external interfacing for multi-signal designs and board-level connectivity.
• Clock Management — Four dedicated delay-locked loops (DLLs) and multiple global/local clock distribution nets provide advanced clock control and low-skew clocking options.
• Configurable Logic and Arithmetic — Dedicated carry logic, multiplier support, and cascade chains facilitate high-speed arithmetic and wide-input functions.
• Reprogrammable SRAM Configuration — SRAM-based in-system configuration offers unlimited re-programmability with multiple programming modes for flexible development and field updates.
• Performance and Standards — Family-level features include system performance up to 200 MHz and 66-MHz PCI compliance, aligning the device to many legacy and system-level interface requirements.
• Package and Mounting — 432-LBGA exposed pad metal package (432-MBGA, 40×40) for surface-mount applications, suitable for dense board integration.
• Qualification and Test — Commercial grade device with 100% factory testing and RoHS compliance.

Typical Applications

• PCI and CompactPCI Systems — PCI-compliant operation and hot-swappable CompactPCI support enable use in industry-standard host and expansion applications.
• High-Performance Digital Systems — Large logic capacity and dedicated arithmetic resources support signal processing, protocol handling, and custom datapath implementations.
• In-System Reconfigurable Designs — SRAM-based unlimited re-programmability is suited for prototyping, iterative hardware development, and designs requiring field updates.
• Interface Bridging and Multi-Standard I/O — High I/O count and multi-standard SelectIO capabilities enable complex interface translation and high-density connectivity tasks.

Unique Advantages

• High integration density: 10,800 logic elements and 468,252 system gates consolidate complex logic into a single device, reducing board-level component count.
• Flexible on-chip memory: Approximately 81,920 bits of embedded RAM plus configurable LUT-based RAM modes simplify memory partitioning and local buffering.
• Advanced clock control: Four dedicated DLLs and layered clock distribution enable precise timing control for synchronous designs.
• Robust I/O capability: 316 I/O pins support extensive external connectivity and multi-standard interface options for diverse system requirements.
• Reprogrammable platform: SRAM-based configuration allows in-system updates and multiple programming modes to accelerate development and lifecycle changes.
• Commercial readiness: RoHS compliance and 100% factory testing provide supply-chain assurance for commercial product development.

Why Choose XCV400-6BG432C?

The XCV400-6BG432C positions itself as a high-capacity, commercially graded FPGA suitable for engineers who need substantial logic density, flexible on-chip memory, and advanced clock management in a single surface-mount package. It is well matched to projects requiring reprogrammable logic, complex datapaths, and extensive I/O in a 432-LBGA form factor.

Backed by Virtex family architecture features and development ecosystem support, this device offers a practical path for scaling designs from prototype to production where commercial-grade temperature and voltage ranges meet system requirements.

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