XCV400-6BG560C

The XCV400-6BG560C is an AMD Virtex® SRAM-based field programmable gate array (FPGA) designed for high-density, reprogrammable logic implementations. It provides 10,800 logic elements, approximately 81,920 bits of on-chip RAM, and 404 user I/Os, making it suitable for designs that require substantial logic capacity, flexible I/O, and embedded memory.

This commercial-grade device is delivered in a 560-pin metal BGA with an exposed pad and supports a core supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant and 100% factory tested per the provided product specification.

Key Features

• Logic Capacity  10,800 logic elements and approximately 468,252 system gates to support complex, high-density logic designs.
• Embedded Memory  Approximately 81,920 bits of on-chip RAM for buffering, temporary storage, and memory-mapped logic functions.
• I/O and Interfaces  404 user I/Os provide extensive external connectivity for custom interfaces and parallel/serial peripherals.
• Clock and Timing  On-chip clock-management with four dedicated delay-locked loops (DLLs), four primary low-skew global clock distribution nets, and 24 secondary local clock nets for advanced clock control and low-skew distribution.
• Arithmetic and Logic Resources  Dedicated carry logic, multiplier support, cascade chains for wide-input functions, and abundant registers with clock enable and synchronous/asynchronous set and reset.
• Configuration and Reprogrammability  SRAM-based in-system configuration with unlimited re-programmability and multiple programming modes (as provided in the Virtex family documentation).
• Package and Mounting  560-LBGA metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) with exposed pad; surface-mount mounting type.
• Power and Environmental  Core supply voltage range of 2.375 V to 2.625 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
• Test and Diagnostics  100% factory tested with built-in IEEE 1149.1 boundary-scan logic and an on-die temperature sensor diode for system diagnostics.

Typical Applications

• Prototyping and Development  Reprogrammable logic resources and abundant I/O make the device suitable for hardware prototyping and iterative design validation.
• Custom I/O Interfaces  High I/O count supports bespoke parallel and serial interfaces and protocol bridging in embedded systems.
• High-density Logic Implementations  Large logic capacity and embedded RAM enable consolidation of complex logic functions and data-paths into a single device.
• Clock-intensive Designs  Integrated DLLs and multi-net clock distribution support applications that require precise clock control and low-skew timing across logic domains.

Unique Advantages

• Significant Logic Density:  10,800 logic elements and roughly 468k system gates provide room to implement complex algorithms and wide datapaths without partitioning across multiple devices.
• Generous I/O Count:  404 user I/Os reduce the need for external multiplexing and simplify board-level routing for multi-channel designs.
• Integrated Clock Management:  Four DLLs and a hierarchical clock network simplify generation, distribution, and control of multiple clock domains on-chip.
• On-chip Memory Resources:  Approximately 81,920 bits of embedded RAM support local buffering and small memory structures without external RAM components.
• Compact, Robust Package:  560-pin metal LBGA with exposed pad provides high pin count in a compact surface-mount form factor suitable for dense PCB layouts.
• Proven Manufacturing:  Fabricated on a 0.22 μm, five-layer-metal process and 100% factory tested for consistent device quality.

Why Choose XCV400-6BG560C?

The XCV400-6BG560C delivers a balanced combination of logic capacity, I/O density, and embedded memory in a surface-mount 560-LBGA package. Its on-chip clock-management resources and dedicated arithmetic support simplify implementation of timing-sensitive and compute-heavy logic, while SRAM-based reprogrammability enables iterative development and in-system updates.

This device is well suited to customers and designs that require high-density programmable logic, extensive external connectivity, and built-in timing resources, all within a commercial temperature grade and RoHS-compliant package backed by comprehensive family-level documentation.

Request a quote or submit your requirements to receive pricing and availability for the XCV400-6BG560C.