XCV400E-6BG560C

The XCV400E-6BG560C is a Virtex®-E series 1.8 V FPGA in a 560-LBGA exposed-pad package, designed for commercial-grade embedded and interface applications. It combines reprogrammable SRAM-based logic with a high pin-count I/O array to support complex glue-logic, protocol bridging, and high-density digital processing.

This device offers a balance of logic capacity, on-chip memory and I/O resources—making it suitable for designs that require flexible, field-upgradeable logic at a commercial temperature range.

Key Features

• Core Architecture Virtex‑E family FPGA architecture with SRAM-based in-system configuration and unlimited re-programmability.
• Logic Capacity Approximately 10,800 logic elements (listed as 10800 logic element cells) and 569,952 gates to implement medium-density logic functions.
• On-Chip Memory Approximately 163,840 bits of embedded RAM (~160 Kbits) for distributed and block memory needs within the FPGA fabric.
• I/O and Signaling 404 user I/O pins in this package; the Virtex‑E family supports high-performance SelectI/O+ standards and differential signaling (LVDS, BLVDS, LVPECL) where applicable.
• Clock Management Series-level clock management includes multiple digital DLLs for clock multiply/divide and duty-cycle control to support synchronous interfaces.
• Power and Supply Internal supply (VCCINT) specified at 1.71 V to 1.89 V for the FPGA core.
• Package and Mounting 560‑LBGA exposed pad, metal package (supplier device package: 560‑MBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
• Environmental and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High‑speed interface bridging Implement protocol translation and bus bridging where a large number of I/Os and flexible signaling standards are required.
• Embedded processing logic Offload custom control and data-path functions using the device’s logic elements and on-chip RAM for buffering and temporary storage.
• Memory interface control Act as an interface controller for external memory systems leveraging the family’s support for high-performance memory interfaces.
• In‑system reconfigurable solutions Deploy field-upgradable logic for iterative product development, firmware updates, or feature extensions without hardware changes.

Unique Advantages

• Balanced logic and memory resources: The combination of ~10,800 logic elements and ~163,840 bits of embedded RAM lets you map moderate-complexity designs without external glue logic.
• High I/O density: 404 I/O pins in a compact 560‑LBGA package support complex multi-channel interfaces and routing flexibility.
• Reprogrammability and development agility: SRAM-based in-system configuration enables unlimited re-programmability for firmware updates and design iteration.
• Commercial-temperature operation: Specified for 0 °C to 85 °C to match a wide range of commercial embedded applications.
• Industry-standard packaging: Surface-mount 560-MBGA (42.5 × 42.5 mm) package provides a robust platform for automated assembly and thermal management via the exposed pad.
• Regulatory readiness: RoHS compliant for global commercial product manufacturing.

Why Choose XCV400E-6BG560C?

The XCV400E-6BG560C packages Virtex‑E family capabilities into a compact, surface-mount 560‑LBGA form factor that suits commercial embedded designs requiring reprogrammable logic, significant I/O, and on-chip RAM. Its combination of approximately 10,800 logic elements, 404 I/Os, and reprogrammable SRAM fabric supports applications ranging from interface controllers to custom data processing blocks.

Choose this device when you need a commercially graded FPGA that provides field-upgradeability, a high I/O count, and documented supply and temperature limits for reliable integration into production systems.

Request a quote or submit a pricing inquiry for XCV400E-6BG560C to receive availability and ordering information.