XCV400E-6BG560C0773

The XCV400E-6BG560C0773 is a Virtex®-E Field Programmable Gate Array (FPGA) IC offering a balance of logic density, I/O capacity, and embedded memory for surface-mount designs. It integrates 2,400 CLBs (providing 10,800 logic elements), approximately 0.16 Mbits of embedded memory (163,840 total RAM bits) and 404 I/O pins, supporting complex logic implementations within a single device.

Packaged in a 560-LBGA exposed pad metal package (supplier device package: 560-MBGA (42.5×42.5)), the device operates from a 1.71 V to 1.89 V supply and is specified for commercial-grade operation from 0°C to 85°C. The device is RoHS compliant.

Key Features

• Core Logic Capacity  2,400 CLBs delivering 10,800 logic elements, enabling substantial programmable logic resources for custom digital functions.
• Logic Density  Approximately 569,952 gates of logic capacity to support complex combinational and sequential logic designs.
• Embedded Memory  Approximately 0.16 Mbits of on-chip RAM (163,840 total RAM bits) for data buffering, FIFO implementation, and small lookup tables.
• I/O Resources  404 general-purpose I/O pins to accommodate wide parallel interfaces and multiple peripheral connections.
• Package and Mounting  560-LBGA exposed pad, metal package designed for surface-mount assembly; supplier package listed as 560-MBGA (42.5×42.5).
• Power  Designed for a core voltage supply in the 1.71 V to 1.89 V range.
• Operating Range and Grade  Commercial-grade device with an operating temperature range of 0°C to 85°C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing processes.

Unique Advantages

• Substantial Logic Resource Pool: The combination of 2,400 CLBs and 10,800 logic elements provides designers with flexible on-chip logic for moderate- to high-complexity designs.
• High I/O Count: 404 I/O pins enable broad connectivity options without external multiplexing, simplifying board-level design for parallel interfaces.
• Compact, Thermally-Aware Package: The 560-LBGA exposed pad metal package supports surface-mount assembly and aids thermal management in space-constrained layouts.
• Embedded Memory for Local Storage: Approximately 0.16 Mbits of on-chip RAM provide on-device storage for buffering and small data structures, reducing external memory requirements.
• Controlled Supply Range: Operation within a defined 1.71 V–1.89 V supply range enables predictable power planning and regulator selection.
• RoHS Compliance: Facilitates integration into lead-free manufacturing flows and meets common environmental restrictions.

Why Choose XCV400E-6BG560C0773?

The XCV400E-6BG560C0773 positions itself as a practical choice for commercial-grade FPGA applications that require a balanced mix of logic density, I/O capacity, and on-chip memory in a compact surface-mount package. Its CLB and logic element resources, along with nearly 404 I/O pins and embedded RAM, provide a versatile platform for consolidating digital functions and reducing external component count.

Engineers and procurement teams seeking a RoHS-compliant Virtex®-E device with defined operating voltage and temperature ranges will find this part suitable for designs where predictable electrical and thermal characteristics are important. The 560-LBGA exposed pad package supports assembly and thermal considerations for system-level integration.

Request a quote for the XCV400E-6BG560C0773 or submit a procurement inquiry to receive pricing and availability information for your design requirements.