XCV400E-6FG676I

The XCV400E-6FG676I is a Virtex®-E field programmable gate array (FPGA) in a 676‑BGA package designed for industrial applications requiring reprogrammable logic, high I/O density, and robust thermal range. It combines 10,800 logic elements with approximately 0.16 Mbits of embedded RAM and 404 user I/Os to support complex control, data-acquisition, and interface functions in industrial systems.

With a 1.71–1.89 V core supply and an industrial operating range from −40 °C to 100 °C, this device is suited for deployments that demand reliable operation across wide temperature extremes while retaining in-system reprogrammability.

Key Features

• Logic Capacity  10,800 logic elements providing programmable logic resources for combinational and sequential functions; equivalent to 569,952 gates as specified.
• Embedded Memory  Total on-chip memory of 163,840 bits (approximately 0.16 Mbits) for distributed and block RAM usage in embedded designs.
• I/O Resources  404 user I/Os to support dense external interfacing and multi-channel sensor, control, or data paths.
• Power and Voltage  Core supply specified at 1.71 V to 1.89 V (1.8 V family device).
• Package and Mounting  676‑BGA package (supplier package: 676‑FBGA, 27×27 mm) with surface-mount mounting type for compact board-level integration.
• Industrial Grade Temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements.
• Virtex‑E Series Capabilities (series-level)  The Virtex‑E family offers 1.8 V architecture with series-level features such as flexible I/O standards support, built-in clock management circuitry, and SRAM-based in-system configuration.

Typical Applications

• Industrial Automation  Logic consolidation, I/O aggregation, and protocol bridging where 404 I/Os and reprogrammable logic simplify system architecture.
• Embedded Control Systems  Deterministic control and sequencing tasks using the device’s logic resources and embedded RAM for local state and buffering.
• Data Acquisition & Instrumentation  High-density I/O and on-chip memory support multi-channel sensor interfacing and pre-processing before transfer to host systems.
• Prototyping and System Integration  Reprogrammable FPGA fabric enables iterative development and integration of custom interfaces and logic functions on a single device.

Unique Advantages

• Substantial Logic & Gate Count: 10,800 logic elements and 569,952 gates provide the capacity to implement complex finite-state machines, datapaths, and control logic without external ASICs.
• High I/O Density: 404 user I/Os reduce the need for external multiplexing and simplify board-level connectivity for multi-channel systems.
• Industrial Thermal Range: Rated −40 °C to 100 °C to support deployments in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 676‑FBGA (27×27) enables high-density PCB designs with a reliable surface-mount footprint.
• RoHS Compliance: Environmentally compliant for use in regulated manufacturing processes.
• SRAM-Based Reprogrammability (series-level): Virtex‑E series SRAM-based configuration enables in-system updates and iterative firmware development.

Why Choose XCV400E-6FG676I?

The XCV400E-6FG676I delivers a balanced combination of logic density, on-chip memory, and a large I/O count in an industrial-grade FPGA package. Its 1.8 V core supply and wide operating temperature range make it suitable for demanding embedded and industrial applications where reprogrammability and compact integration are priorities.

This device is a practical choice for system designers seeking a reconfigurable platform that consolidates logic and I/O, reduces BOM complexity, and supports field updates throughout product lifecycles.

Request a quote or submit an RFQ to receive pricing and availability for the XCV400E-6FG676I and to discuss your volume and lead-time requirements.