XCV400E-6PQ240I

IC FPGA 158 I/O 240QFP
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 158 163840 10800 240-BFQFP

Quantity 1,139 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case240-BFQFPNumber of I/O158Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates569952ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XCV400E-6PQ240I – Virtex®-E Field Programmable Gate Array, 10800 logic elements

The XCV400E-6PQ240I is a Virtex®-E family FPGA IC offering reprogrammable, high-density logic in a 240-pin BFQFP package. Built on a 1.8 V core and SRAM-based configuration, this device targets applications that require substantial on-chip logic and flexible high-speed I/O.

With 10800 logic elements, approximately 0.16 Mbits of embedded memory, and 158 user I/O pins, the device is suited for industrial applications needing configurable logic, high-bandwidth interfaces, and robust temperature operation.

Key Features

  • Core Density and Gates — 10800 logic elements and approximately 569,952 equivalent system gates provide significant programmable logic capacity for complex functions.
  • On‑Chip Memory — Total on‑chip RAM of 163,840 bits (approximately 0.16 Mbits), compatible with the Virtex‑E SelectRAM+ memory architecture described in the family datasheet.
  • I/O Capacity and Standards — 158 user I/O pins with SelectI/O+ technology support; family-level differential signalling and interface standards (LVDS, BLVDS, LVPECL) are supported as part of the Virtex‑E feature set.
  • Clock Management and Performance — 1.8 V core operation with documented family performance (up to 130 MHz internal performance for four LUT levels) and extensive clock management circuitry in the Virtex‑E architecture.
  • Configuration and Process — SRAM-based in-system reprogrammability for iterative development and deployment; manufactured on a 0.18 μm, 6-layer metal process as specified for the Virtex‑E family.
  • Package and Mounting — 240-BFQFP (240-PQFP, 32×32) surface-mount package for compact board integration.
  • Power and Temperature — Core voltage supply specified at 1.71 V to 1.89 V; rated operating temperature −40 °C to 100 °C suitable for industrial environments.
  • Standards and Compliance — RoHS compliant and 100% factory tested as noted for the Virtex‑E production specification.

Typical Applications

  • High‑Speed Interface Bridging — Implement protocol conversion and interface bridging using the device’s flexible I/O and differential signalling support.
  • Memory Controller and Glue Logic — Use embedded RAM and the Virtex‑E memory hierarchy to implement controllers and buffering between high‑speed external memories and system logic.
  • Industrial Embedded Systems — Deploy reconfigurable logic and custom control functions in industrial equipment that require the specified −40 °C to 100 °C operating range.
  • Prototyping and Development — Leverage SRAM-based in-system reprogramming for iterative hardware development and functional validation.

Unique Advantages

  • High Logic Capacity: 10800 logic elements and roughly 569,952 gates enable complex custom hardware implementations without adding external logic.
  • On-Board Memory: Approximately 0.16 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
  • Flexible High‑Speed I/O: 158 I/O pins with support for industry differential standards enable reliable, high-bandwidth links to sensors, transceivers, and memory devices.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
  • Reprogrammable Architecture: SRAM-based in-system configuration simplifies updates and field changes during product development and maintenance.
  • Compact Surface-Mount Package: 240-BFQFP package balances pin count and board area for space-constrained designs.

Why Choose XCV400E-6PQ240I?

The XCV400E-6PQ240I combines a substantial logic element count, on-chip memory, and flexible I/O in a surface-mount 240-BFQFP package, making it a practical choice for industrial embedded applications and high‑speed interface designs. Core voltage and temperature ratings align with industrial deployment needs while maintaining reprogrammable development flexibility.

This device is appropriate for engineering teams requiring a reconfigurable platform with tangible on-chip resources and established family-level features (SelectI/O+, SelectRAM+, DLL-based clock management) to accelerate system-level integration and iteration.

Request a quote or submit a product inquiry to receive pricing and availability information for the XCV400E-6PQ240I. Our team will respond with a formal quote and lead-time details.

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