XCV400E-7BG432I

The XCV400E-7BG432I is a Virtex®-E series SRAM-based FPGA offering 10,800 logic elements and approximately 0.16 Mbits of on-chip RAM. Designed for industrial applications, it provides a high I/O count (316 pins) and a 432-LBGA exposed-pad package for surface-mount assembly.

This device targets high-performance, reprogrammable logic implementations where dense logic, significant embedded memory, and extensive I/O bandwidth are required. It operates from a VCCINT supply range of 1.71 V to 1.89 V and is specified for operation from -40 °C to 100 °C.

Key Features

• Core Density — 10,800 logic elements and 569,952 equivalent gates provide substantial programmable logic capacity for complex functions.
• Embedded Memory — Total on-chip RAM of 163,840 bits (approximately 0.16 Mbits) for distributed and block RAM usage.
• I/O and Interface Support — 316 I/O pins; series-level support includes SelectI/O+ technology and multiple differential standards such as LVDS, BLVDS, and LVPECL as described in the Virtex‑E family documentation.
• Clock Management — Device family includes advanced clock management with eight fully digital DLLs for flexible clocking and DDR-friendly timing.
• Configuration and Reprogrammability — SRAM-based in-system configuration enabling unlimited reprogramming for iterative design and field updates.
• Package and Mounting — 432-LBGA exposed pad metal package (supplier package listed as 432-MBGA 40×40) optimized for surface-mount production.
• Electrical and Environmental — VCCINT 1.71 V to 1.89 V operating range and industrial temperature rating from -40 °C to 100 °C. RoHS compliant.

Typical Applications

• High-speed interface controllers: Use the device’s high I/O count and differential signaling support to implement PCI and other high-bandwidth interfaces described for the Virtex‑E family.
• Embedded system logic: Implement complex control, data-path, and protocol logic using the device’s 10,800 logic elements and on-chip RAM for buffering and state storage.
• Memory interface and bridging: Leverage the series‑level memory hierarchy and clock-management features for interfacing to external memories and creating memory controllers.

Unique Advantages

• High logic capacity: 10,800 logic elements enable implementation of substantial digital functions without external glue logic.
• Extensive I/O resources: 316 I/O pins provide flexibility to connect multiple peripherals, busses, and differential interfaces directly to the FPGA.
• Reprogrammable architecture: SRAM-based configuration allows in-system updates and iterative development without hardware changes.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in demanding operating environments.
• Robust packaging: 432-LBGA exposed-pad metal package supports reliable surface-mount assembly and thermal performance.
• Development ecosystem: Series documentation references support by Xilinx Foundation and Alliance Series development systems for design and compile flows.

Why Choose XCV400E-7BG432I?

The XCV400E-7BG432I combines a meaningful balance of programmable logic density, embedded memory, and high I/O count in a robust 432-LBGA package for industrial applications. Its SRAM-based architecture supports in-system reprogramming, making it suitable for iterative development, field updates, and designs that evolve over time.

This FPGA is well suited to engineers and teams building complex interface logic, memory controllers, or high-density digital systems that require a combination of performance, reprogrammability, and industrial temperature capability. The device’s documented series features—advanced clock management, differential signaling support, and development-tool support—help shorten integration time and scale designs within the Virtex‑E family framework.

Request a quote or submit a procurement inquiry today to evaluate the XCV400E-7BG432I for your next FPGA-based design project.