XCV400E-7FG676C

IC FPGA 404 I/O 676FCBGA
Part Description

Virtex®-E Field Programmable Gate Array (FPGA) IC 404 163840 10800 676-BGA

Quantity 630 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O404Voltage1.71 V - 1.89 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2400Number of Logic Elements/Cells10800
Number of Gates569952ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits163840

Overview of XCV400E-7FG676C – Virtex®-E FPGA, 676-BGA

The XCV400E-7FG676C is a Virtex®-E field programmable gate array (FPGA) in a 676-ball BGA package, offered as a commercial-grade, surface-mount device. It delivers a high-density, reprogrammable logic platform with 10,800 logic elements, extensive I/O, and on-chip embedded memory suitable for high-performance digital designs and system-level interfaces.

Built on the Virtex‑E family architecture, the device targets applications that require flexible I/O standards, clock management, and substantial on-chip resources for memory-intensive or interface-centric designs.

Key Features

  • Logic Capacity — 10,800 logic elements (approx. 569,952 equivalent gates) for implementing complex combinational and sequential logic.
  • Embedded Memory — Approximately 0.16 Mbits of embedded memory (163,840 total RAM bits) for distributed and block RAM requirements.
  • I/O Density & Package — 404 user I/O pins in a 676‑FBGA (27×27) surface-mount package for high-pin-count board-level connectivity.
  • Voltage and Temperature — Core supply range 1.71 V to 1.89 V; commercial operating temperature 0 °C to 85 °C.
  • Family-Level Performance — Virtex‑E family features, including up to 130 MHz internal performance (four LUT levels) and support for multiple high-speed interface standards.
  • Advanced I/O and Signalling — Series-level SelectI/O+ technology supports a wide range of high-performance interfaces and differential signalling options for system-level interoperability.
  • Clock Management — Family architecture provides dedicated clock-management resources (eight DLLs) to support clock multiply/divide and tight timing control.
  • Reprogrammability — SRAM-based in-system configuration enables unlimited reprogramming for iterative development and field updates.
  • Compliance — RoHS compliant; commercially graded device.

Typical Applications

  • High‑Speed Interfaces — Implement PCI-compliant and other high-bandwidth bus interfaces using the device’s flexible I/O and signalling support.
  • Memory Interface Controllers — Use on-chip RAM and family-level SelectRAM+ features to build controllers for ZBT SRAM or DDR SDRAM designs.
  • Communications and Networking — Leverage dense logic and abundant I/O for protocol processing, packet framing, and differential signalling endpoints.
  • Embedded System Prototyping — Rapidly iterate system logic and peripherals with in-system reprogrammability and integrated clock-management resources.

Unique Advantages

  • High logic and gate density: 10,800 logic elements and ~569,952 equivalent gates provide the capacity to integrate complex functions on a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 0.16 Mbits of embedded memory supports buffer, FIFO, and small data-store implementations without external RAM.
  • Robust I/O capability: 404 I/Os in a compact 676‑FBGA package enable dense board routing and multiple high-performance interfaces.
  • Flexible clocking: Family-provided DLLs allow precise clock management for timing-critical designs and DDR applications.
  • Field reprogrammability: SRAM-based configuration lets you update logic and fix bugs in-system, shortening development cycles.
  • Standards-oriented integration: Virtex‑E family features include support for PCI and a wide set of differential and single‑ended I/O standards for easier system integration.

Why Choose XCV400E-7FG676C?

The XCV400E-7FG676C combines a high logic count, meaningful embedded memory, and a large I/O set in a commercial-grade Virtex‑E device, delivering a flexible platform for developers building high-performance interfaces, memory controllers, and complex digital logic. Its family-level clocking and I/O capabilities make it suitable for designs that demand precise timing and multiple signaling standards.

This part is well suited to engineering teams seeking a reprogrammable, high-density FPGA with proven architecture and the ability to consolidate system functions, simplify BOM, and accelerate development and iteration.

Request a quote or submit a product inquiry to check availability and pricing for the XCV400E-7FG676C. Our team can assist with lead times, packaging options, and volume pricing information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up